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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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350824-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 2 Position, 6.35 mm [.25 in] Centerline, Fully Shrouded, Gold (Au), Universal MATE-N-LOK | Other | 350824-4 |
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350824-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Type Socket | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Underplating Ma | Header, Shrouded - Straight PTH Box | 350824-1 |
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350827-1
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Socket | Contact Underplating Material Thickness 50 MICIN | Contac | Other | 350827-1 |
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350825-1
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 19 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | C | Header, Shrouded - Straight PTH Box | 350825-1 |
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350828-4
TE Connectivity
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1 | Configuration Features: Number of Positions 9 | PCB Mount Orientation Vertical | Number of Power Positions 9 | Number of Rows 3 | Contact Features: Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Matrix | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plati | Other | 350828-4 |
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350829-1
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 12 Position, 6.35 mm [.25 in] Centerline, Fully Shrouded, Pre-Tin, Universal MATE-N-LOK | Other | 350829-1 |
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350825-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 3 Position, 6.35 mm [.25 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Universal MATE-N-LOK | Other | 350825-4 |
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SJ3-350820B-TR
Same Sky
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1 | 3.5 mm Stereo Jack, Through Hole, 2 Conductors, 1 Internal Switches, Tape & Reel Packaging | Other | SJ3-350820B-TR |
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SJ3-35082B-TR
Same Sky
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1 | 3.5 mm Stereo Jack, Through Hole, 2 Conductors, 1 Internal Switches, Tape & Reel Packaging | Other | SJ3-35082B-TR |
3
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350828-2
TE's AMP
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1 | 9 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET | 350828-2 |
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350829-4
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | PCB Mount Orientation Vertical | Number of Power Positions 12 | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 19 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Type Socket | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Co | 350829-4 |
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350826-1
TE Connectivity
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1 | Rectangular Power Connector, 4 Contact(s), Female, Solder Terminal, Plug | 350826-1 |
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350827-1
TE's AMP
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1 | 6 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET, ROHS COMPLIANT | 350827-1 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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350827-2
TE's AMP
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1 | 6 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET | 350827-2 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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350828-4
TE's AMP
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1 | 9 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT | 350828-4 |
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350828-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Positions 9 | Number of Rows 3 | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 12 | 350828-1 |
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350826-2
TE Connectivity
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1 | Combination Line Connector, 4 Contact(s), Female, Solder Terminal, Socket | 350826-2 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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350829-2
TE Connectivity
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1 | Combination Line Connector, 12 Contact(s), Female, Solder Terminal, Socket | 350829-2 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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350827-4
TE's AMP
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1 | 6 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT | 350827-4 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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350826-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Type Socket | Contact Current Rating (Ma | 350826-4 |
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350825-2
TE Connectivity
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1 | Combination Line Connector, 3 Contact(s), Female, Solder Terminal, Socket | 350825-2 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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35082410
Aptiv PLC
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1 | Terminal Block Accessory | 35082410 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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350829-2
TE's AMP
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1 | 12 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET | 350829-2 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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350822-1
TE Connectivity
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1 | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 2 MICM | Contact Current Rating (Max) 35 AMP | Wire Contact Termination Area Plating Thickness 2 – 4 MICM | Contact Mating Area Plating Material Tin | Contact Type Hermaphroditic | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Finish Bright | Wire Contact Termination Area Plating Material Finish Bright | Contact Orientation Straight | Contact Mating Area Plat | 350822-1 |
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350827-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Contact Mating Area Plating Material Gold | Contact Type Socket | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Layout Matrix | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Cont | 350827-4 |
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