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Technical Content

35083 Model Download Search Results

Showing 25 of 1302 results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
35083 MENDA/EasyBraid
0 35083
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350833-1 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Type Socket | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Mat Other 350833-1
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
350831-1 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Type Socket | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 19 AMP | Contact Underp Other 350831-1
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
350830-1 TE Connectivity
1 Configuration Features: Number of Positions 15 | PCB Mount Orientation Vertical | Number of Power Positions 15 | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 19 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Matrix | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Mat Other 350830-1
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
55935-0830 Molex
1 Headers & Wire Housings 2.0 WtB Plg Hsg Assy Plg Hsg Assy RA 8Ckt Other 55935-0830
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
350837-1 TE's AMP
1 15 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET, ROHS COMPLIANT 350837-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350831-2 TE Connectivity
1 2 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER 350831-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350838-2 TE Connectivity
1 CONNECTOR ACCESSORY 350838-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350835-2 TE's AMP
1 9 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET 350835-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350836-4 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 3 | Number of Power Positions 12 | Number of Positions 12 | Contact Features: Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Socket | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Retention Within Housing Without | Contact Layout Matrix 350836-4
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
350835-1 TE's AMP
1 9 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET, ROHS COMPLIANT 350835-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350830-2 TE's AMP
1 15 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET 350830-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350837-2 TE's AMP
1 15 CONTACT(S), MALE AND FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET 350837-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350835-4 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 9 | Number of Rows 3 | Number of Positions 9 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Layout Matrix | Contact Type Socket | Contact Mating Area Plating M 350835-4
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
350835-1 TE Connectivity
1 Configuration Features: Number of Power Positions 9 | Number of Positions 9 | Number of Rows 3 | PCB Mount Orientation Vertical | Contact Features: Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Layout Matrix | Contact Retention Within Housing W 350835-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
350836-1 TE Connectivity
1 Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Vertical | Number of Rows 3 | Number of Positions 12 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Type Socket | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 12 AMP | Contact Layout Inline | Multi 350836-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
350834-4 TE Connectivity
1 Configuration Features: Number of Power Positions 6 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 6 | Contact Features: Contact Mating Area Plating Material Gold | Contact Type Socket | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Current Rating (Max) 12 AMP | Contact Layout Matrix | Multiple Contact Types Without | PCB Contact Termination Area 350834-4
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
350837-2 TE Connectivity
1 15 CONTACT(S), MALE AND FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET 350837-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350834-2 TE's AMP
1 6 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET 350834-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350834-1 TE's AMP
1 6 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET, ROHS COMPLIANT 350834-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350833-4 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Current Rating (Max) 19 AMP | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Type Socket | Contact Mating Area Plating Material Thickne 350833-4
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
350837-4 TE Connectivity
1 Configuration Features: Number of Rows 3 | Number of Power Positions 15 | PCB Mount Orientation Vertical | Number of Positions 15 | Contact Features: Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 100 350837-4
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
350834-4 TE's AMP
1 6 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT 350834-4
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350837-4 TE's AMP
1 15 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT 350837-4
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
350830-1 TE's AMP
1 15 CONTACT(S), FEMALE, COMBINATION LINE CONNECTOR, SOLDER, SOCKET, ROHS COMPLIANT 350830-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
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