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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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640500-1
TE Connectivity
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1 | Configuration Features: Number of Columns 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 3 | Number of Signal Positions 6 | Number of Power Positions 0 | Contact Features: Contact Current Rating (Max) 6 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material T | Other | 640500-1 |
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640506-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 36 | Number of Columns 4 | Number of Rows 9 | Number of Signal Positions 36 | Number of Power Positions 0 | Contact Features: Contact Layout Inline | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2 MICM | PCB Contact Termination Area Plating Material Tin | | Other | 640506-3 |
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640502-1
TE Connectivity
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1 | Configuration Features: Number of Columns 3 | Number of Signal Positions 12 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 4 | Number of Power Positions 0 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2 MICM | Contact Type Pin | Contact Retention Within Housing With | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 79 MICIN | Cont | Other | 640502-1 |
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640506-1
TE Connectivity
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1 | Configuration Features: Number of Positions 36 | PCB Mount Orientation Vertical | Number of Power Positions 0 | Number of Rows 9 | Number of Columns 4 | Number of Signal Positions 36 | Contact Features: Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2 MICM | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Pla | Other | 640506-1 |
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640503-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 0 | Number of Positions 15 | Number of Columns 3 | Number of Rows 5 | Number of Signal Positions 15 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2 MICM | Contact Mating Area Plating Material Tin | Contact Retention Within Housing With | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Thickness 79 MICIN | PCB Contact Termination Area Pla | Other | 640503-1 |
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640500-5
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 6 | Number of Positions 6 | Number of Power Positions 0 | Number of Rows 3 | PCB Mount Orientation Vertical | Number of Columns 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material Thickness 2 MICM | Contact Type Pin | Contac | Other | 640500-5 |
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2-640502-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 4 | Number of Power Positions 0 | Number of Columns 3 | Number of Positions 12 | Number of Signal Positions 12 | Contact Features: PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Retention Within Housing With | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thick | Other | 2-640502-4 |
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640501-3
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 9 | Number of Rows 3 | Number of Columns 3 | Number of Positions 9 | Number of Power Positions 0 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing With | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 79 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material T | Other | 640501-3 |
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KAI-04050-QBA-JD-BA
onsemi
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1 | Image Sensors INTERLINE CCD IMG | Other | KAI-04050-QBA-JD-BA |
3
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VSRAF-04-40-50-00-G
AirBorn
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1 | Board to Board & Mezzanine Connectors CONNECTOR, VERSI | Other | VSRAF-04-40-50-00-G |
3
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SST-10-UV-A130-F405-00
Luminus Devices Inc.
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1 | High Power LEDs - Single Color UV LED 405nm | Other | SST-10-UV-A130-F405-00 |
3
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B3F-4050
Omron Electronics
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1 | lvory Plunger Tactile Switch, SPST-NO 0.05 A@ 24 V dc 3mm | Other | B3F-4050 |
3
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3405.0175.24
SCHURTER
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1 | Schurter 8A F Non-Resettable Surface Mount Fuse, 125 V dc, 250 V ac | Other | 3405.0175.24 |
2
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MM74HC4050N
onsemi
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1 | Hex Inverting Logic Level Down Converter • Hex Logic Level Down Converter, PDIP-16 | Dual-In-Line Packages | MM74HC4050N |
3
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504050-0691
Molex
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1 | Pico-Lock SMT Wire-to-Board Header 6 way Molex Pico-Lock Series, Series Number 504050, 1.5mm Pitch 6 Way 1 Row Shrouded Right Angle PCB Header, Surface Mount | Other | 504050-0691 |
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505405-0670
Molex
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1 | Headers & Wire Housings 1.5 CLIKMate REC WB 6CKT VRT SR GLD PLTG | Other | 505405-0670 |
3
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CT04-050
ICE Components
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1 | Current Transformers SMT Current Sense Xfmr 20A, 1:50 | Other | CT04-050 |
3
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504050-0291
Molex
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1 | Headers & Wire Housings 1.5MM PicoLock SMT HDR RA POS SIDLCK 2P | Other | 504050-0291 |
3
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TL4050B41QDBZRQ1
Texas Instruments
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1 | Automotive Catalog Precision Micropower Shunt Voltage Reference | SOT23 (3-Pin) | TL4050B41QDBZRQ1 |
3
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LM4050CIM3-4.1/NOPB
Texas Instruments
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1 | Texas Instruments LM4050CIM3-4.1/NOPB, Shunt Voltage Reference 4.096V, ±0.1%, 3-Pin SOT-23 | SOT23 (3-Pin) | LM4050CIM3-4.1/NOPB |
3
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TL4050A10IDCKT
Texas Instruments
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1 | Voltage References Precision Micropower Shunt Vltg Ref | SOT23 (5-Pin) | TL4050A10IDCKT |
3
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DMC564050R
Panasonic
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1 | DMC564050R, Dual Digital Transistor, NPN 100 MA 50 V Ratio Of 10 kΩ, 6-Pin SMini6 F3 B | SO Transistor Flat Lead | DMC564050R |
3
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M74HC4050RM13TR
STMicroelectronics
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1 | STMICROELECTRONICS - M74HC4050RM13TR - NON INVERTING BUFFER, SOP-16 | Small Outline Packages | M74HC4050RM13TR |
3
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LM4050QAEM3-2.5/NOPB
Texas Instruments
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1 | Automotive 50ppm/C Precision Micropower Shunt Voltage Reference | SOT23 (3-Pin) | LM4050QAEM3-2.5/NOPB |
3
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TL4050C41QDCKR
Texas Instruments
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1 | Precision Micropower Shunt Voltage Reference | SOT23 (5-Pin) | TL4050C41QDCKR |
3
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