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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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640500-1
TE Connectivity
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1 | Configuration Features: Number of Columns 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 3 | Number of Signal Positions 6 | Number of Power Positions 0 | Contact Features: Contact Current Rating (Max) 6 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material T | Other | 640500-1 |
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640506-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 36 | Number of Columns 4 | Number of Rows 9 | Number of Signal Positions 36 | Number of Power Positions 0 | Contact Features: Contact Layout Inline | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2 MICM | PCB Contact Termination Area Plating Material Tin | | Other | 640506-3 |
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640506-1
TE Connectivity
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1 | Configuration Features: Number of Positions 36 | PCB Mount Orientation Vertical | Number of Power Positions 0 | Number of Rows 9 | Number of Columns 4 | Number of Signal Positions 36 | Contact Features: Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2 MICM | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Pla | Other | 640506-1 |
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640502-1
TE Connectivity
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1 | Configuration Features: Number of Columns 3 | Number of Signal Positions 12 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 4 | Number of Power Positions 0 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2 MICM | Contact Type Pin | Contact Retention Within Housing With | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 79 MICIN | Cont | Other | 640502-1 |
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640503-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 0 | Number of Positions 15 | Number of Columns 3 | Number of Rows 5 | Number of Signal Positions 15 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2 MICM | Contact Mating Area Plating Material Tin | Contact Retention Within Housing With | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Thickness 79 MICIN | PCB Contact Termination Area Pla | Other | 640503-1 |
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640500-5
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 6 | Number of Positions 6 | Number of Power Positions 0 | Number of Rows 3 | PCB Mount Orientation Vertical | Number of Columns 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material Thickness 2 MICM | Contact Type Pin | Contac | Other | 640500-5 |
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2-640502-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 4 | Number of Power Positions 0 | Number of Columns 3 | Number of Positions 12 | Number of Signal Positions 12 | Contact Features: PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Retention Within Housing With | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thick | Other | 2-640502-4 |
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640501-3
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 9 | Number of Rows 3 | Number of Columns 3 | Number of Positions 9 | Number of Power Positions 0 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing With | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 79 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material T | Other | 640501-3 |
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1 | PCB terminal block; push-button; 2.5 mm²; Pin spacing 5/5.08 mm; 5-pole; suitable for Ex-e applications; CAGE CLAMP®; commoning option | Other | 256-405/000-009/999-950 |
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250-405/000-006
Wago
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1 | PCB terminal block; push-button; 0.5 mm²; Pin spacing 2.5 mm; 5-pole; Push-in CAGE CLAMP® | Other | 250-405/000-006 |
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250-405/000-012
Wago
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1 | PCB terminal block; push-button; 0.5 mm²; Pin spacing 2.5 mm; 5-pole; Push-in CAGE CLAMP® | Other | 250-405/000-012 |
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54684-0504
Molex
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1 | Board to Board & Mezzanine Connectors 0.4BB RECASSY50CKT NI BARRIER | Other | 54684-0504 |
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CD4050BDW
Texas Instruments
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1 | Texas Instruments CD4050BDW, Hex Buffer, Converter, DTL, TTL, Non-Inverting, 5 → 15 V, 16-Pin SOIC | Small Outline Packages | CD4050BDW |
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5054050470
Molex
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1 | CONN RCPT 4POS 0.059 GOLD SMD | Other | 5054050470 |
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PTN04050AAH
Texas Instruments
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1 | Texas Instruments PTN04050AAH, DC-DC Power Supply Module 7 V Input,, 5-Pin, DIP Module | Other | PTN04050AAH |
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DF12(4.0)-50DP-0.5V(86)
Hirose
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1 | HIROSE(HRS) - DF12(4.0)-50DP-0.5V(86) - HEADER, 4MM HEIGHT, 50WAY | Other | DF12(4.0)-50DP-0.5V(86) |
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VSRAF-04-40-50-00-G
Molex
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1 | Board to Board & Mezzanine Connectors CONNECTOR, VERSI | Other | VSRAF-04-40-50-00-G |
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PMEG4050EP
Nexperia
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1 | Schottky barrier diode 40V 5A SOD128 NXP PMEG4050EP, SMT Schottky Schottky Barrier Diode, 40V 5A, 2-Pin SOD-128 | Small Outline Diode Flat Lead | PMEG4050EP |
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DF12D(4.0)-50DP-0.5V(81)
Hirose
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1 | 0.5mm pitch PCB 50 way header Hirose DF12 Series, 0.5mm Pitch 50 Way 2 Row Straight PCB Header, Solder Termination | Other | DF12D(4.0)-50DP-0.5V(81) |
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140-506-415-100
EDAC
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1 | Headers & Wire Housings 6 Position Inline Connector | Other | 140-506-415-100 |
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DMC-264050R
Panasonic
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1 | DMC264050R, Dual Digital Transistor, NPN 100 MA 50 V Ratio Of 10 kΩ, Common Base, 6-Pin Mini6 G4 B | SOT23 (6-Pin) | DMC-264050R |
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SST-10-UV-B130-F405-00
Luminus Devices Inc.
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1 | High Power LEDs - Single Color UV LED 400-405nm 810mW Flux | Other | SST-10-UV-B130-F405-00 |
3
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48405-0001
Molex
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1 | Conn USB Type A RCP 9 POS 2mm Solder RA Thru-Hole 9 Terminal 1 Port | Other | 48405-0001 |
3
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MIC94050YM4 TR
Microchip
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1 | P-Channel MOSFET Transistor, 1.8 A, 6 V, 4-Pin SOT-143 Micrel MIC94050YM4 TR | Other | MIC94050YM4 TR |
2
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STK4050II
Sanyo
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1 | AE Power Amplifier | Other | STK4050II |
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