40672 Model Download Search Results
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44067-2002
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits | Other | 44067-2002 |
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44067-2402
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits | Other | 44067-2402 |
3
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5406721-2
TE Connectivity
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1 | Body Features: PCB Retention Feature Material Phosphor Bronze | Connector Profile Low | Modular Jack Latch Orientation Inverted - Latch Up | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8 | Number of Positions 8 | Status Light Type Not Illuminated | PCB Mount Orientation Right Angle | Port Configuration Single Port | Connector Contact Density Standard | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact | Other | 5406721-2 |
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44067-2401
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits | Other | 44067-2401 |
3
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440672202
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits, Tin (Sn) Plating | Other | 440672202 |
3
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440672002
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating | Other | 440672002 |
3
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44067-2201
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits | Other | 44067-2201 |
3
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5406721-3
TE Connectivity
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1 | Body Features: PCB Retention Feature Material Phosphor Bronze | Connector Profile Low | Modular Jack Latch Orientation Inverted - Latch Up | Configuration Features: PCB Mount Orientation Right Angle | Connector Contact Density Standard | Status Light Type Not Illuminated | Port Configuration Single Port | Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Number of Positions 8 | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact | Other | 5406721-3 |
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44067-2001
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits | Other | 44067-2001 |
3
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860240672002
Würth Elektronik
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1 | WCAP-AT1H Aluminum Electrolytic Capacitors ATDC110100M050DSPA3E000; THT Radial; 10 µF ± 20%; 50 V(DC); 5000 h; -40°C / +105°C; size DxL 5.0 x 11.0; pitch 2.0; Pin ˜ 0.5; Max. Iripple 97 mA @100 kHz; LC 5 µA; DF 10% | Capacitor, Polarized Radial Diameter | 860240672002 |
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440672201
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits, Tin (Sn) Plating | Other | 440672201 |
3
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440672003
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating | Other | 440672003 |
3
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44067-2203
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits | Other | 44067-2203 |
3
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44067-2003
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits | Other | 44067-2003 |
3
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44067-2202
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits | Other | 44067-2202 |
3
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440672402
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, Tin (Sn) Plating | Other | 440672402 |
3
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440672403
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, Tin (Sn) Plating | Other | 440672403 |
3
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44067-2403
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits | Other | 44067-2403 |
3
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5406721-1
TE Connectivity
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1 | Body Features: Connector Profile Low | PCB Retention Feature Material Phosphor Bronze | Modular Jack Latch Orientation Inverted - Latch Up | Configuration Features: PCB Mount Orientation Right Angle | Number of Loaded Positions 8 | Port Configuration Single Port | Number of Positions 8 | Status Light Type Not Illuminated | Connector Contact Density Standard | Port Matrix Configuration 1 x 1 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICI | Other | 5406721-1 |
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440672401
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, Tin (Sn) Plating | Other | 440672401 |
3
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440672203
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits, Tin (Sn) Plating | Other | 440672203 |
3
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440672001
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating | Other | 440672001 |
3
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406721-2
TE's AMP
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1 | 8 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SURFACE MOUNT, JACK | 406721-2 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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406725-1
TE Connectivity
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1 | Telecom and Datacom Connector | 406725-1 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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406721-3
TE's AMP
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1 | 8 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SURFACE MOUNT, JACK | 406721-3 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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