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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-1445097-2
TE Connectivity
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1 | MICRO MNL HDR ASSY S/ROW AU LF | Other | 3-1445097-2 |
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76044-5001
Molex
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1 | CONNECTOR, SFP+, RCPT, 40POS, PRESS FIT | Other | 76044-5001 |
3
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8564-4500JL
3M
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1 | 64 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold | Other | 8564-4500JL |
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04450070FX850
LITTELFUSE
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1 | FUSE MTL 2A/ BULK ROHS COMPLIANT: YES | Other | 04450070FX850 |
3
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8564-4500PL
3M
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1 | HEADERS CONNECTORS 64WAYS 3M 8500 Series 2.54mm Pitch 64 Way 2 Row Straight PCB Socket, Through Hole, Solder Termination | Header, Receptacle - Straight PTH Box | 8564-4500PL |
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2-1445094-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contac | Other | 2-1445094-2 |
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SLP21614450Z
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, THT, Male, Pitch 2.54mm x 2.54mm, 50 Position | Other | SLP21614450Z |
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2-1445096-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 2 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Surface Mount, Power, Micro MATE-N-LOK | Other | 2-1445096-2 |
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2-1445085-3
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickn | Other | 2-1445085-3 |
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AX5DCF4-450.0000
ABRACON
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1 | OSC XO 450MHZ 1.8V LVDS | Other | AX5DCF4-450.0000 |
3
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8T49N445-000ASGI8
Renesas Electronics
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1 | The IDT8T49N445I is a quad PLL with FemtoClock® NG technology. The IDT8T49N445I integrates low phase noise Frequency Translation / Synthesizer and jitter attenuation. It includes alarm and monitoring functions suitable for networking and communications applications. The device has four fully independent PLLs, each PLL is able to generate any output frequency in the 0.98MHz - 312.5MHz range and most output frequencies in the 312.5MHz - 1,300MHz range. A wide range of input reference clocks may be used as th | BGA | 8T49N445-000ASGI8 |
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2-1445052-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contac | Other | 2-1445052-2 |
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SLP21614450GECO
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SLP21614450GECO |
3
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SIT9367AI-2C1-25E644.500000
SiTime
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1 | 220 MHz to 725 MHz Ultra-low Jitter Differential Oscillator, 5 x 3.2mm Package | Other | SIT9367AI-2C1-25E644.500000 |
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1844507
Phoenix Contact
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1 | PTSA 0,5/ 6-2,5-ZI GY - Printed circuit board terminal, nominal current: 2 A, rated voltage (III/2): 250 V, nominal cross section: 0.5 mm2, number of potentials: 6, number of rows: 1, number of positions per row: 6, product range: PTSA 0,5, pitch: 2.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: gray, Pin layout: Zigzag pinning M, Solder pin [P]: 3.6 mm, number of solder pins per potential: 1, type of packaging: packe | Other | 1844507 |
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2-1445050-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Power Positions 6 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | | Other | 2-1445050-6 |
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2-1445050-3
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 3 | Number of Power Positions 3 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Withou | Other | 2-1445050-3 |
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2-1445055-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 3 | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating M | Other | 2-1445055-3 |
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2-1445051-5
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Matin | Other | 2-1445051-5 |
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2-1445055-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating | Other | 2-1445055-4 |
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CMF16-104450
Triad Magnetics
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1 | 100 mH @ 10 kHz 2 Line Common Mode Choke Through Hole 450mA DCR 3.22Ohm , 250V , -40°C ~ 105°C | Other | CMF16-104450 |
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76044-5002
Molex
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1 | I/O Connectors Stacked SFP+ 2X1 con nn assy w/ tin tails | Other | 76044-5002 |
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AX5PAF4-450.0000C
ABRACON
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1 | OSC XO 450MHZ 3.3V LVPECL | Other | AX5PAF4-450.0000C |
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2-1445053-5
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 5 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOK | Other | 2-1445053-5 |
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2-1445053-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MIC | Other | 2-1445053-6 |
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