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305-044-500-202
EDAC
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1 | EDAC - 305-044-500-202 - CARD EDGE CONN, DUAL SIDE, 44POS, PANEL | Other | 305-044-500-202 |
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144-5018
RS Pro
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0 | 50 MHz Clock Oscillator, ±50ppm CMOS, 4-Pin SMD | Other | 144-5018 |
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144-5062
RS Pro
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1 | 1.3V-5.5V, 2A, 60mΩ ULTRA-LOW LEAKAGE LOAD SWITCH | Other | 144-5062 |
3
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1445088-8
TE Connectivity
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1 | MICRO MNL HDR ASSY S/ROW AU LF | Other | 1445088-8 |
3
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231-445/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5 mm; 15-pole | Other | 231-445/001-000 |
3
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6834-4500PL
3M
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1 | Headers & Wire Housings 34P STR PLRZD SKT | Header, Receptacle - Straight PTH Box | 6834-4500PL |
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MS244-5.00M-1%
Caddock
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1 | Type MS Power Film Resistor | Resistors, Axial Diameter Horizontal Mounting | MS244-5.00M-1% |
3
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1-640445-0
TE Connectivity
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1 | Headers & Wire Housings FRCTN LK HDR STR 10P Square post tin | Other | 1-640445-0 |
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9164-4500PL
3M
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1 | CONN RCPT 64POS 0.1 GOLD PCB | Header, Receptacle - Straight PTH Box | 9164-4500PL |
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EC11E1544505
ALPS Electric
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1 | Encoder, LP,11mm,SMD,15 pulse,switched Alps 15 Pulse Incremental Mechanical Rotary Encoder with a 6 mm Slot Shaft, SMD | Other | EC11E1544505 |
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721-445/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; 100% protected against mismating; Pin spacing 5 mm; 15-pole | Other | 721-445/001-000 |
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2-1445050-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Th | Other | 2-1445050-8 |
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2-1445088-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Terminat | Other | 2-1445088-6 |
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AX7MBF4-450.0000
ABRACON
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1 | XTAL OSC XO 450.0000MHZ CML SMD | Other | AX7MBF4-450.0000 |
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2-1445085-6
TE Connectivity
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1 | Connector Header Through Hole 6 position 0.118" (3.00mm) , UL94 V-0 , 250V , 100.0µin , -40°C ~ 105°C | Other | 2-1445085-6 |
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AX7PBF4-450.0000C
ABRACON
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1 | XTAL OSC XO 450.0000MHZ LVPECL | Other | AX7PBF4-450.0000C |
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234450
TE Connectivity
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1 | ERNI, 1.27mm Pitch 3 Way 1 Row Right Angle PCB Header, Solder Termination, 4A | Other | 234450 |
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744393445015
Würth Elektronik
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1 | WE-XHMI Performance SMT Power Inductor Size 6030; L = 1.5 µH ±20%; IR = 22 A; Isat = 19.9 A; RDCmax = 7 mΩ | Other | 744393445015 |
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2-1445093-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Cont | Other | 2-1445093-5 |
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2-1445057-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Are | Other | 2-1445057-5 |
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AX5PAF4-450.0000
ABRACON
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1 | OSC XO 450MHZ 3.3V LVPECL | Other | AX5PAF4-450.0000 |
3
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2-1445055-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention W | Other | 2-1445055-5 |
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2-1445054-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Other | 2-1445054-4 |
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2-1445050-9
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 3 | Other | 2-1445050-9 |
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1-1445088-0
TE Connectivity
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1 | CONN HEADER R/A 10POS 3MM | Other | 1-1445088-0 |
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