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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
3-1445097-2 TE Connectivity
1 MICRO MNL HDR ASSY S/ROW AU LF Other 3-1445097-2 1 Download Model
Part Image Part Image 1 CONNECTOR, SFP+, RCPT, 40POS, PRESS FIT Other 76044-5001 1 Download Model
Part Image Part Image 1 64 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold Other 8564-4500JL 1 Download Model
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04450070FX850 LITTELFUSE
1 FUSE MTL 2A/ BULK ROHS COMPLIANT: YES Other 04450070FX850 1 Download Model
Part Image Part Image 1 HEADERS CONNECTORS 64WAYS 3M 8500 Series 2.54mm Pitch 64 Way 2 Row Straight PCB Socket, Through Hole, Solder Termination Header, Receptacle - Straight PTH Box 8564-4500PL 1 Download Model
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2-1445094-2 TE Connectivity
1 Configuration Features: Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contac Other 2-1445094-2 1 Download Model
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SLP21614450Z Fischer Elektronik GmbH & Co. KG
1 Dual Row, THT, Male, Pitch 2.54mm x 2.54mm, 50 Position Other SLP21614450Z 1 Download Model
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2-1445096-2 TE Connectivity
1 PCB Mount Header, Vertical, Wire-to-Board, 2 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Surface Mount, Power, Micro MATE-N-LOK Other 2-1445096-2 1 Download Model
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2-1445085-3 TE Connectivity
1 Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickn Other 2-1445085-3 1 Download Model
Part Image Part Image 1 OSC XO 450MHZ 1.8V LVDS Other AX5DCF4-450.0000 1 Download Model
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8T49N445-000ASGI8 Renesas Electronics
1 The IDT8T49N445I is a quad PLL with FemtoClock® NG technology. The IDT8T49N445I integrates low phase noise Frequency Translation / Synthesizer and jitter attenuation. It includes alarm and monitoring functions suitable for networking and communications applications. The device has four fully independent PLLs, each PLL  is able to generate any output frequency in the 0.98MHz - 312.5MHz range and most output frequencies in the 312.5MHz - 1,300MHz range. A wide range of input reference clocks may be used as th BGA 8T49N445-000ASGI8 1 Download Model
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2-1445052-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contac Other 2-1445052-2 1 Download Model
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SLP21614450GECO Fischer Elektronik GmbH & Co. KG
1 male header Other SLP21614450GECO 1 Download Model
Part Image Part Image 1 220 MHz to 725 MHz Ultra-low Jitter Differential Oscillator, 5 x 3.2mm Package Other SIT9367AI-2C1-25E644.500000 1 Download Model
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1844507 Phoenix Contact
1 PTSA 0,5/ 6-2,5-ZI GY - Printed circuit board terminal, nominal current: 2 A, rated voltage (III/2): 250 V, nominal cross section: 0.5 mm2, number of potentials: 6, number of rows: 1, number of positions per row: 6, product range: PTSA 0,5, pitch: 2.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: gray, Pin layout: Zigzag pinning M, Solder pin [P]: 3.6 mm, number of solder pins per potential: 1, type of packaging: packe Other 1844507 1 Download Model
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2-1445050-6 TE Connectivity
1 Configuration Features: Number of Positions 6 | Number of Power Positions 6 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Other 2-1445050-6 1 Download Model
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2-1445050-3 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 3 | Number of Power Positions 3 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Withou Other 2-1445050-3 1 Download Model
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2-1445055-3 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 3 | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating M Other 2-1445055-3 1 Download Model
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2-1445051-5 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Matin Other 2-1445051-5 1 Download Model
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2-1445055-4 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Other 2-1445055-4 1 Download Model
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CMF16-104450 Triad Magnetics
1 100 mH @ 10 kHz 2 Line Common Mode Choke Through Hole 450mA DCR 3.22Ohm , 250V , -40°C ~ 105°C Other CMF16-104450 1 Download Model
Part Image Part Image 1 I/O Connectors Stacked SFP+ 2X1 con nn assy w/ tin tails Other 76044-5002 1 Download Model
Part Image Part Image 1 OSC XO 450MHZ 3.3V LVPECL Other AX5PAF4-450.0000C 1 Download Model
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2-1445053-5 TE Connectivity
1 PCB Mount Header, Vertical, Wire-to-Board, 5 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOK Other 2-1445053-5 1 Download Model
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2-1445053-6 TE Connectivity
1 Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MIC Other 2-1445053-6 1 Download Model
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