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SIT3541AIA1CF331SM128.450560
SiTime
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1 | 1 to 340 MHz Endura™ Series I 2C/SPI Programmable Oscillator, 5 x 3.2mm Package | Other | SIT3541AIA1CF331SM128.450560 |
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SIT3541AIA1CF331SB128.450560
SiTime
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1 | 1 to 340 MHz Endura™ Series I 2C/SPI Programmable Oscillator, 5 x 3.2mm Package | Other | SIT3541AIA1CF331SB128.450560 |
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ADA4505-1ARJZ-R2
Analog Devices
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1 | Analog Devices ADA4505-1ARJZ-R2 Micropower Op Amp, 50kHz Rail-Rail, 1.8 → 5 V, 5-Pin SOT-23 | SOT23 (5-Pin) | ADA4505-1ARJZ-R2 |
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2-1445053-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area | Other | 2-1445053-3 |
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2-1445057-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445057-3 |
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2314505-1
TE Connectivity
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1 | PCB Mount Header, Horizontal, Wire-to-Board, 5 Position, 1.8 mm [.07 in] Centerline, Fully Shrouded, Through Hole - Solder, Signal, Black, Reel | Other | 2314505-1 |
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2-1445053-5
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 5 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOK | Other | 2-1445053-5 |
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2-1445055-9
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 9 | Number of Power Positions 9 | PCB Mount Orientation Right Angle | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Platin | Other | 2-1445055-9 |
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2-1445057-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Ar | Other | 2-1445057-4 |
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ADA4505-2ARMZ-RL
Analog Devices
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1 | PSRR: 100 dB minimumCMRR: 105 dB typicalVery low supply current: 10 μA per amplifier maximum1.8 V to 5 V single-supply or ±0.9 V to ±2.5 V dual-supply operationRail-to-rail input and output3 mV offset voltage maximumVery low input bias current: 0.5 pA typical | Small Outline Packages | ADA4505-2ARMZ-RL |
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2-1445053-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating M | Other | 2-1445053-4 |
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2-1445057-7
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 7 | Number of Power Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material | Other | 2-1445057-7 |
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2-1445054-3
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | Multiple Contact Types Without | Contact Layout Inline | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Materia | Other | 2-1445054-3 |
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2-1445055-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | C | Other | 2-1445055-2 |
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2-1445051-5
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Matin | Other | 2-1445051-5 |
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2-1445055-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Power Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Dimensions: PCB | Other | 2-1445055-8 |
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2-1445056-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Mul | Other | 2-1445056-2 |
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2-1445053-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Multiple Contact Types Without | Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating M | Other | 2-1445053-2 |
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2-1445057-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 8 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PC | Other | 2-1445057-8 |
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2-1445053-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Terminatio | Other | 2-1445053-8 |
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2-1445050-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Are | Other | 2-1445050-2 |
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2-1445052-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contac | Other | 2-1445052-2 |
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2-1445050-3
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 3 | Number of Power Positions 3 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Withou | Other | 2-1445050-3 |
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2-1445055-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 3 | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating M | Other | 2-1445055-3 |
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CDM845-05B-FP-F010-67
Same Sky
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1 | 5 Pins, PCB Panel Mount, PC Pins, Right Angle, Front Fastened M8 x 1.0, B-Coding, Screw Copper Alloy, IP67, M8 Male Circular Connector Jack | Other | CDM845-05B-FP-F010-67 |
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