460-8 Model Download Search Results
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52746-0871-TR250
Molex
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1 | Molex 52746 Series 0.5mm Pitch 8 Way SMT Female FPC Connector, ZIF | Other | 52746-0871-TR250 |
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15246084
Molex
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1 | Mini-Fit BMI Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, PA Polyamide Nylon | Other | 15246084 |
3
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15246083
Molex
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1 | Mini-Fit BMI Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, PA Polyamide Nylon | Other | 15246083 |
3
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52746-0871
Molex
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1 | Molex Easy-On 52746 Series 0.5mm Pitch 8 Way Right Angle SMT Female FPC Connector, ZIF Bottom Contact | Other | 52746-0871 |
3
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15246081
Molex
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1 | Mini-Fit BMI Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 8 Circuits, PA Polyamide Nylon 6/6 | Other | 15246081 |
3
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15246080
Molex
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1 | Mini-Fit BMI Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, PA Polyamide Nylon | Other | 15246080 |
3
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15246082
Molex
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1 | Mini-Fit BMI Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 8 Circuits, PA Polyamide Nylon 6/6 | Other | 15246082 |
3
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7-215460-8
TE Connectivity
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1 | Body Features: Connector Profile Standard | Primary Product Color Red | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 8 | Contact Features: Contact Current Rating (Max) 1.5 AMP | PCB Contact Termination Area Plating Material Thickness 118.11 – 196.85 MICIN | Contact Mating Area Plating Material Thickness 118.11 – 196.85 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | PCB Contact | Other | 7-215460-8 |
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15246087
Molex
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1 | Mini-Fit BMI Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, PA Polyamide Nylon | Other | 15246087 |
3
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215460-8
TE Connectivity
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1 | Body Features: Connector Profile Standard | Primary Product Color Red | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 118.11 – 196.85 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 3 – 5 MICM | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Finish | Other | 215460-8 |
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215460-8
TE Connectivity
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1 | Body Features: Connector Profile Standard | Primary Product Color Red | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 118.11 – 196.85 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 3 – 5 MICM | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Finish | Other | 215460-8 |
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7-215460-8
TE Connectivity
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1 | Body Features: Connector Profile Standard | Primary Product Color Red | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 8 | Contact Features: Contact Current Rating (Max) 1.5 AMP | PCB Contact Termination Area Plating Material Thickness 118.11 – 196.85 MICIN | Contact Mating Area Plating Material Thickness 118.11 – 196.85 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | PCB Contact | Other | 7-215460-8 |
3
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0460812000
Molex
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1 | Conn HDR 4 POS 6.38mm Press Fit RA Thru-Hole 24 Terminal | Other | 0460812000 |
3
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4608H-101-102LF
Bourns
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1 | Resistor Networks & Arrays 8pins 1Kohms Bussed | Other | 4608H-101-102LF |
3
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4608X-101-332LF
Bourns
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1 | Bourns Bussed Resistor Network 3.3kΩ ±2% 7 Resistors, 1W Total, SIP package 4600X Through Hole | Other | 4608X-101-332LF |
3
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4608X-102-104LF
Bourns
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1 | Bourns Isolated Resistor Array 100kΩ ±2% 4 Resistors, 1W Total, SIP Package 4600X Through Hole | Other | 4608X-102-104LF |
3
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4608X-102-394 LF
Bourns
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1 | Resistor Networks & Arrays 390Kohm 1% Isolated | Other | 4608X-102-394 LF |
3
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4608X-102-153LF
Bourns
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1 | Bourns 4600X Series 15kΩ Isolated Resistor Network, 4 Resistors, 1W total SIP Package Pin | Other | 4608X-102-153LF |
3
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AX7DBF1-460.8000C
ABRACON
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1 | XTAL OSC XO 460.8000MHZ LVDS SMD | Other | AX7DBF1-460.8000C |
3
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AX7PAF1-460.8000C
ABRACON
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1 | XTAL OSC XO 460.8000MHZ LVPECL | Other | AX7PAF1-460.8000C |
3
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SiT1569AC-J3-33E-0460.800000
SiTime
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1 | µPower, Ultra-Small 1 Hz – 462.5 kHz ±50 ppm Oscillator, World’s smallest oscillator footprint: 1.2 mm101 | Other | SiT1569AC-J3-33E-0460.800000 |
3
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1 | ARM Microcontrollers - MCU LPC54608J512BD208/LQFP208///STANDARD MARKING * TRA | Other | LPC54608J512BD208 |
2
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AX7DBF1-460.8000
ABRACON
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1 | XTAL OSC XO 460.8000MHZ LVDS SMD | Other | AX7DBF1-460.8000 |
3
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AX7DAF1-460.8000
ABRACON
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1 | Oscillator XO 460.8MHz ±50ppm LVDS 55% 3.3V 8-Pin SMD T/R | Other | AX7DAF1-460.8000 |
3
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AX5PAF1-460.8000
ABRACON
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1 | 460.8 MHz XO (Standard) LVPECL Oscillator 3.3V Enable/Disable 8-SMD, No Lead | Other | AX5PAF1-460.8000 |
3
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