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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BFC247946304
Vishay
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1 | MKP 300nF 5% 250Vdc Pitch 7,5mm | Other | BFC247946304 |
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4-794619-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 12 | Number of Positions 12 | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating | Other | 4-794619-2 |
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4-794680-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 16 | PCB Mount Orientation Vertical | Number of Power Positions 16 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mati | Other | 4-794680-6 |
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4-794620-2
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | Number of Power Positions 12 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | | Other | 4-794620-2 |
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4-794680-4
TE Connectivity
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1 | Configuration Features: Number of Positions 14 | Number of Power Positions 14 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794680-4 |
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HEF4794BT-Q100J
Nexperia
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1 | HEF4794B-Q100 - 8-stage shift-and-store register LED driver@en-us | Other | HEF4794BT-Q100J |
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4-794633-0
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 10 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOKr | Other | 4-794633-0 |
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4-794625-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold | | Other | 4-794625-0 |
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1724479418
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 18 Circuits, Nylon 6/6, UL 94V-0 Glow-Wire Capable, Red | Other | 1724479418 |
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1724479420
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 20 Circuits, Nylon 6/6, UL 94V-0 Glow-Wire Capable, Red | Other | 1724479420 |
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4-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794630-2 |
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1724479412
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, 12 Circuits, Nylon 6/6, UL 94V-0, Tin (Sn) Plating, Glow-Wire Capable, Red | Other | 1724479412 |
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4-794681-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Rows 2 | Number of Signal Positions 0 | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Mat | Other | 4-794681-0 |
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4-794630-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickn | Other | 4-794630-6 |
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4-794618-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 18 | PCB Mount Orientation Right Angle | Number of Positions 18 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Other | 4-794618-8 |
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MSP430F4794IPZ
Texas Instruments
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1 | Texas Instruments MSP430F4794IPZ, 16bit MSP430 Microcontroller, 16MHz, 60 kB Flash, 100-Pin LQFP | Quad Flat Packages | MSP430F4794IPZ |
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HEF4794BT,112
Nexperia
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1 | NXP HEF4794BT,112 8-stage Shift Register, Serial to Serial/Parallel, 3 → 15 V, 16-Pin SOIC | Small Outline Packages | HEF4794BT,112 |
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BFC247946114
Vishay
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1 | 0.11 µF Film Capacitor 160V 250V Polypropylene (PP), Metallized Radial | Other | BFC247946114 |
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4-794620-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 14 | Number of Positions 14 | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794620-4 |
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4-794628-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Right Angle | Number of Positions 12 | Number of Rows 2 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact | Other | 4-794628-2 |
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4-794632-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | Header, Receptacle - Straight PTH Box | 4-794632-6 |
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HEF4794BT,118
Nexperia
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1 | HEF4794B - 8-stage shift-and-store register LED driver@en-us | Small Outline Packages | HEF4794BT,118 |
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1724479410
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, 10 Circuits, Nylon 6/6, UL 94V-0, Tin (Sn) Plating, Glow-Wire Capable, Red | Other | 1724479410 |
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4-794682-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 12 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Through Hole - Solder, Micro MATE-N-LOK | Other | 4-794682-2 |
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4-794682-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 4.81 MICM | Contact Retention Within Housing Without | Contact | Other | 4-794682-0 |
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