5-583 Model Download Search Results
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1375583-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 5 | Contact Features: Contact Current Rating (Max) 3 AMP | Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Thickness .381 MICM | Mating Square Post Dimension .64 MM | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination | Other | 1375583-4 |
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5-1375583-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin-Lead | Contact Current Rating (Max) 3 AMP | Contact Base Material Brass | Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .025 INCH | Contact Type Pin | Contact Mating Area Plati | Other | 5-1375583-1 |
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SLG55583V
Renesas Electronics
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1 | The SLG55583 is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.2 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. The SLG55583 can also support CDP mode (FAST charging and data communication available mode if smartphone can support CDP mode.) The SLG555 | Small Outline No-lead | SLG55583V |
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1755833
Phoenix Contact
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1 | MSTBVA 2,5/12-G-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 12, number of rows: 1, number of positions: 12, number of connections: 12, product range: MSTBVA 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pat | Other | 1755833 |
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SLG55583AV
Renesas Electronics
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1 | The SLG55583A is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.2 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. The SLG55583A can also support CDP mode (FAST charging and data communication available mode if smartphone can support CDP mode.) The SLG5 | Small Outline No-lead | SLG55583AV |
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5558344-1
TE Connectivity
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1 | Body Features: Shield Plating Material Tin | PCB Ground Tab Location -.12 INCH | Shield Material Copper Alloy | Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location -3.05 MM | Configuration Features: Number of Positions 8 | Number of PCB Ground Tabs 2 | Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Connector Contact Density Standard | Panel Ground Location Top/Bottom | PCB Mount Orientation Right Angle | | Other | 5558344-1 |
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5558341
TE Connectivity
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1 | Modular Jack & Plug Interface Type : RJ45 | Other | 5558341 |
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1-2375558-3
TE Connectivity
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1 | PCB Mount Header, Wire-to-Board, 2 Position, 3.96 mm [.156 in] Centerline, Power & Signal, Natural, Economy Power | Other | 1-2375558-3 |
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LTC5583IUF#PBF
Analog Devices
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1 | UF Package 24-Lead Plastic QFN (4mm × 4mm) | Quad Flat No-Lead | LTC5583IUF#PBF |
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5558342-1
TE Connectivity
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1 | Body Features: PCB Ground Tab Location -.12 INCH | Modular Jack Latch Orientation Standard - Latch Down | Shield Material Copper Alloy | Shield Plating Material Tin | PCB Ground Tab Location -3.05 MM | Connector Profile Low | Configuration Features: PCB Mount Orientation Right Angle | Status Light Type Not Illuminated | Port Matrix Configuration 1 x 1 | Port Configuration Single Port | Number of PCB Ground Tabs 2 | Number of Loaded Positions 6 | Number of Positions 8 | Connector Contact Density Standard | C | Other | 5558342-1 |
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AD5583YRVZ
Analog Devices
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1 | Quad, Parallel Input, Voltage Output, 10-Bit Digital-to-Analog Converter | Small Outline Packages | AD5583YRVZ |
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1955837
Phoenix Contact
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1 | PCB header, nominal cross section: 2.5 mm?, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 11, Number of rows: 1, Number of positions per row: 11, number of connections: 11, product range: CCV 2,5/..-GF, pitch: 5.08 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, Stecksystem: CLASSIC COMBICON, Locking: Screw locking, type of packaging: 88 mm wide tape, User information and design | Other | 1955837 |
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1-1735583-1
TE Connectivity
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1 | MSATA, RECEPTACLE, R/A SMT, BTM, 16 position | Other | 1-1735583-1 |
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HDL6V5583
ABLIC Inc.
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1 | Switch ICs - Various Ultrasound Digital Transmit Pulsers | Other | HDL6V5583 |
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LTC5583IUF#TRPBF
Analog Devices
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1 | RF Detector Matched Dual-Channel 6GHz RMS Power Detector Measures VSWR | Quad Flat No-Lead | LTC5583IUF#TRPBF |
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74435583300
Würth Elektronik
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1 | WE-HCI SMT Flat Wire High Current Inductor Size 2212; L = 33 µH ±20%; IR = 11.5 A; Isat = 15.0 A; RDC = 13.20 mΩ | Inductors Precision Moulded | 74435583300 |
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5-1375583-3
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 4 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Gold, Surface Mount, Signal, Black, AMPMODU MTE | Other | 5-1375583-3 |
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5558341-1
TE Connectivity
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1 | Body Features: Connector Profile Standard | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Status Light Type Not Illuminated | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Loaded Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Connector Contact Density Standard | Contact Features: Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1.5 AMP | Contact Base Materi | Other | 5558341-1 |
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5558310-1
TE Connectivity
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1 | Body Features: Shield Plating Material Tin | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location -3.05 MM | Shield Material Copper Alloy | Connector Profile Low | PCB Ground Tab Location -.12 INCH | Configuration Features: Port Configuration Single Port | Port Matrix Configuration 1 x 1 | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of PCB Ground Tabs 2 | Connector Contact Density Standard | C | Other | 5558310-1 |
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1-2040558-3
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 6 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Dynamic 1000 Series | Other | 1-2040558-3 |
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5-583853-2
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Wire Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Finish Matte | Contact Retention Within Housing With | Contact Current Rating (Max) 5 AMP | Contact Type Socket | Dimensions: Wire Size .2 – .6 MMSQ | Wire Size 404 – 1020 CMA | Wire Size 24 – 20 AWG | Compatible Insulation Diameter Range .048 – .06 I | 5-583853-2 |
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5-583649-2
TE Connectivity
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1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing With | Contact Base Material Phosphor Bronze | Contact Type Socket | Wire Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Material Gold | Dimensions: Compatible Insulation Diameter Range 1.14 – 2.41 MM | Wire Size 22 – 18 AWG | Compatible Insulation Diameter Range .045 – .095 INCH | Wire Size | 5-583649-2 |
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5-583649-3
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Gold | Contact Retention Within Housing With | Contact Type Socket | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Current Rating (Max) 5 AMP | Wire Contact Termination Area Plating Material Tin-Lead | Dimensions: Wire Size .3 – .9 MMSQ | Compatible Insulation Diameter Range .045 – .095 INCH | Wire Size 22 – 18 AWG | Wire Size 642 – 1624 CMA | Compatible | 5-583649-3 |
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5-583361-2
TE Connectivity
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1 | Contact Features: Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Finish Matte | Contact Type Socket | Dimensions: Wire Size 22 – 18 AWG | Compatible Insulation Diameter Range 1.4 – 2.03 MM | Wire Size 642 – 1624 CMA | Wire Size .3 – .9 MMS | 5-583361-2 |
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5-583857-5
TE Connectivity
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1 | Contact Features: Contact Type Socket | Contact Mating Area Plating Material Tin-Lead | PCB Contact Termination Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 5 AMP | Wire Contact Termination Area Plating Material Tin-Lead | Wire Contact Termination Area Plating Material Finish Bright | Operation/Application: Circuit Application Power & Signal | Packaging Features: Packaging Quantity 5000 | Packagi | 5-583857-5 |
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