50508 Model Download Search Results
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50508
ARK-LES Connectors
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1 | Fork Terminal | 50508 |
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50508
Pulse Electronics Corporation
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1 | General Purpose Inductor, 2700uH, 20%, 1 Element | 50508 |
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5050864-5
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) 5 AMP | Contact Spring Plating Thickness .762 MICM | Contact Base Material Beryllium Copper | Contact Spring Plating Material Gold | Dimensions: PCB Hole Diameter | Other | 5050864-5 |
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5050865-5
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 30 MICM | Contact Base Material Beryllium Copper | Contact Current Rating (Max) 6.5 AMP | Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Thickness .762 MICM | Contact Spring Plating Material Gold | Dimensions: Mating Pin Diam | Other | 5050865-5 |
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5050871-1
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 7.5 AMP | Contact Mating Area Plating Material Thickness 30 MICM | Contact Base Material Beryllium Copper | Contact Spring Plating Material Gold | Contact Spring Plating Thickness .762 MICM | Dimensions: Socket Length 7 | Other | 5050871-1 |
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5050865-3
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Current Rating (Max) 6.5 AMP | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Thickness .762 MICM | Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Material Gold | Contact Base Material Beryllium Copper | Dimensions: Socket Length 6 | Other | 5050865-3 |
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L150-50805006000S0
Lumileds
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1 | High Power LEDs - White White 5000 K 80-CRI, LUXEON 5050 | Other | L150-50805006000S0 |
3
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SM150508-7
DB Unlimited
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1 | Speakers & Transducers 15x11x3, 8 Ohm SPRING CONTACTS | Other | SM150508-7 |
3
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250-508/000-050
Wago
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1 | PCB terminal block; push-button; 1.5 mm²; Pin spacing 5 mm; 8-pole; Push-in CAGE CLAMP® | Other | 250-508/000-050 |
3
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250-508/000-012
Wago
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1 | PCB terminal block; push-button; 1.5 mm²; Pin spacing 5 mm; 8-pole; Push-in CAGE CLAMP® | Other | 250-508/000-012 |
3
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1-5050871-9
TE Connectivity
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1 | Discrete PCB socket, open bottom, 7.32mm | Other | 1-5050871-9 |
3
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2-1445050-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Th | Other | 2-1445050-8 |
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1-5050871-0
TE Connectivity
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1 | SOCKET,MIN-SPR W/H SN-AU SER-5 | Other | 1-5050871-0 |
3
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2250508-1
TRP Connector
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1 | Modular Connectors / Ethernet Connectors RJ45,1X1,10G BASE-T TAB UP | Other | 2250508-1 |
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IRSM505-084DA
Infineon
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1 | Motor / Motion / Ignition Controllers & Drivers MICRO MCM | Other | IRSM505-084DA |
3
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L150-5080500600HH0
Lumileds
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1 | White LEDs 5000K 80CRI | Other | L150-5080500600HH0 |
3
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XAL5050-822MEC
COILCRAFT
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1 | Power Inductors - SMD 8.2uH Shld 20% 6.1A 34.95mOhms AECQ2 | Other | XAL5050-822MEC |
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2-5050871-3
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Thickness .762 MICM | Contact Base Material Beryllium Copper | Contact Spring Plating Material Gold | Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) 7.5 AMP | Dimensions: Wire Size 1.31 | Other | 2-5050871-3 |
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250-508
Wago
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1 | PCB terminal block; push-button; 1.5 mm²; Pin spacing 5 mm; 8-pole; Push-in CAGE CLAMP® | Other | 250-508 |
3
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5050863-6
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Base Material Beryllium Copper | Contact Current Rating (Max) 4 AMP | Contact Spring Plating Thickness 2.54 MICM | Contact Spring Plating Material Tin | Dimensions: Socket Length .26 INCH | Wire Size 28 – 22 AWG | Mating Pin Diameter Ran | 5050863-6 |
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50508-8
ARK-LES Connectors
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1 | Fork Terminal | 50508-8 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5050863-7
TE Connectivity
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1 | Interconnection Device | 5050863-7 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5050863-1
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 30 MICM | Contact Spring Plating Thickness .762 MICM | Contact Current Rating (Max) 4 AMP | Contact Spring Plating Material Gold | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Thickness 30 MICIN | Dimensions: Wire Size .081 †| 5050863-1 |
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5050864-1
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Beryllium Copper | Contact Spring Plating Thickness .762 MICM | Contact Mating Area Plating Material Thickness 30 MICM | Contact Spring Plating Material Gold | Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Dimensions: PCB Thickness (Re | 5050864-1 |
1
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5050863-8
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Material Tin | Contact Current Rating (Max) 4 AMP | Contact Base Material Beryllium Copper | Contact Spring Plating Thickness 2.54 MICM | Dimensions: Wire Size .081 – .326 MMSQ | PCB Hole Diameter 1.32 MM | PCB Thickness ( | 5050863-8 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/050/508/645/5050864-5-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/050/508/645/5050864-5-t1.jpg/jcr:content/renditions/product-details.png",null])
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/050/508/653/5050865-3-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/050/508/653/5050865-3-t1.jpg/jcr:content/renditions/product-details.png",null])
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![Part Image](["https://www.mouser.com/images/bel/images/2250508-1_SPL.jpg",null,null])
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