5050871-8 Model Download Search Results
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5050871-8
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Beryllium Copper | Contact Current Rating (Max) 7.5 AMP | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .031 – .125 INCH | PCB Thickness (Recommen | 5050871-8 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/050/508/718/5050871-8-t1.jpg/jcr:content/renditions/product-details.png",null,null])
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