50864 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	50864 TE Connectivity	1	Body Features: Sleeve Material Copper \| Sleeve Plating Material Gold Flash over Nickel \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Base Material Beryllium Copper \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) 5 AMP \| Contact Spring Plating Thickness .762 MICM \| Contact Spring Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Spring Plating Thickness 30 MICIN \| Dimensions	Other	50864	3D model available Symbol and footprint available 3	1 Download Model
	50864 HELUKABEL	1	Wire And Cable, 1 Conductor(s), 0000AWG, 1000V, Flexible Cord And Fixture Wire		50864	3D model not available Symbol and footprint not available 0	0 Build or Request
	TPS65086401RSKR Texas Instruments	1	Power Management Specialized - PMIC A 595-TPS65086401RSKT	Quad Flat No-Lead	TPS65086401RSKR	3D model available Symbol and footprint available 3	1 Download Model
	TPS6508640RSKR Texas Instruments	1	Power Management Specialized - PMIC A 595-TPS6508640RSKT	Quad Flat No-Lead	TPS6508640RSKR	3D model available Symbol and footprint available 3	1 Download Model

	TPS6508640RSKT Texas Instruments	1	Configurable Multi-Rail PMIC for Xilinx MPSoCs and FPGAs	Quad Flat No-Lead	TPS6508640RSKT	3D model available Symbol and footprint available 3	1 Download Model
	TPS6508641RSKT Texas Instruments	1	Configurable Multi-Rail PMIC for Xilinx MPSoCs and FPGAs	Quad Flat No-Lead	TPS6508641RSKT	3D model available Symbol and footprint available 3	1 Download Model
	TPS6508641RSKR Texas Instruments	1	Programmable Multi Channel PMIC to 64-Pin VQFN EP T/R	Quad Flat No-Lead	TPS6508641RSKR	3D model available Symbol and footprint available 3	1 Download Model
	TPS65086401RSKT Texas Instruments	1	Configurable Multi-Rail PMIC for Xilinx MPSoCs and FPGAs	Quad Flat No-Lead	TPS65086401RSKT	3D model available Symbol and footprint available 3	1 Download Model
	TPS65086470RSKT Texas Instruments	1	Configurable Multi-Rail PMIC for Xilinx MPSoCs and FPGAs	Quad Flat No-Lead	TPS65086470RSKT	3D model available Symbol and footprint available 3	1 Download Model
	TPS65086470RSKR Texas Instruments	1	Power Management Specialized - PMIC Configurable Multi-Rail PMIC for Xilinx MPSoCs and FPGAs 64-VQFN -40 to 85	Quad Flat No-Lead	TPS65086470RSKR	3D model available Symbol and footprint available 3	1 Download Model
	5050864-5 TE Connectivity	1	Body Features: Sleeve Plating Material Tin \| Sleeve Material Copper \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Spring Plating Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) 5 AMP \| Contact Spring Plating Thickness .762 MICM \| Contact Base Material Beryllium Copper \| Contact Spring Plating Material Gold \| Dimensions: PCB Hole Diameter	Other	5050864-5	3D model available Symbol and footprint available 3	1 Download Model
	50864R Wurth Elektronik	1	Telecom Transformer		50864R	3D model not available Symbol and footprint not available 0	0 Build or Request
	50864-8 TE Connectivity	1	Interconnection Device		50864-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	50864-4 TE's AMP	1	Interconnection Device		50864-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	50864-7 TE Connectivity	1	Interconnection Device		50864-7	3D model not available Symbol and footprint not available 0	0 Build or Request

	50864-3 TE Connectivity	1	Interconnection Device		50864-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	50864-3 TE's AMP	1	Interconnection Device		50864-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	50864-1 TE Connectivity	1	SOCKET,MIN-SPR SN-AU SER-3		50864-1	3D model available Symbol and footprint not available 1	1 Download Model
	50864-8 TE's AMP	1	Interconnection Device		50864-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	50864-7 TE's AMP	1	Interconnection Device		50864-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	50864-5 TE Connectivity	1	SOCKET,MIN-SPR W/H SN-AU SER-3		50864-5	3D model available Symbol and footprint not available 1	1 Download Model
	50864-4 TE Connectivity	1	Interconnection Device		50864-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	50864-6 TE Connectivity	1	SOCKET,MIN-SPR SN SER-3		50864-6	3D model available Symbol and footprint not available 1	1 Download Model
	550-8640-60-02-36 Cambion Electronics Ltd	1	General Purpose Inductor, 8200uH, 10%, 1 Element		550-8640-60-02-36	3D model not available Symbol and footprint not available 0	0 Build or Request
	550-8640-05-01-36 Cambion Electronics Ltd	1	General Purpose Inductor, 0.22uH, 10%, 1 Element		550-8640-05-01-36	3D model not available Symbol and footprint not available 0	0 Build or Request
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