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TPS65086470RSKT - Texas Instruments

Description: Configurable Multi-Rail PMIC for Xilinx MPSoCs and FPGAs

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PCB Footprints
TPS65086470RSKT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - rsk(s-pvqfn-n64)
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TPS65086470RSKT - Texas Instruments  - 3D model - Quad Flat No-Lead - rsk(s-pvqfn-n64)
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TPS65086470RSKT Details

  • Manufacturer Part Number:

    TPS65086470RSKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • Input Voltage-Max:

    21 V

  • Input Voltage-Min:

    5.6 V

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    9

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    25 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    -0.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    21 V

  • Supply Voltage-Min (Vsup):

    5.6 V

  • Supply Voltage-Nom (Vsup):

    13 V

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    3100 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

TPS65086470RSKT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended layout and placement guide in the datasheet, but it's essential to follow good PCB design practices, such as keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise.
  • To optimize performance, consider factors such as input voltage, output voltage, load current, and operating temperature. Use the device's simulation models and tools, such as TI's WEBENCH Power Designer, to simulate and optimize your design. Additionally, consult the datasheet and application notes for guidance on component selection and layout.
  • The TPS65086470RSKT has a thermal pad that must be connected to a solid ground plane to ensure reliable operation. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Monitor the device's junction temperature (TJ) and ensure it stays within the recommended operating range.
  • The TPS65086470RSKT is a high-reliability device, but it's essential to follow proper design and manufacturing practices to ensure reliability and safety. Consult the datasheet and relevant industry standards (e.g., IEC 61508, ISO 26262) for guidance on designing and verifying safety-critical systems.
  • To troubleshoot issues, start by reviewing the datasheet and application notes, and then follow a systematic approach to identify the root cause. Check the input voltage, output voltage, and load current, and verify that the device is properly configured and laid out. Use oscilloscopes and thermal imaging tools to help diagnose issues.

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TPS65086470RSKT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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