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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-1375583-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin-Lead | Contact Current Rating (Max) 3 AMP | Contact Base Material Brass | Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .025 INCH | Contact Type Pin | Contact Mating Area Plati | Other | 5-1375583-1 |
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1375583-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 5 | Contact Features: Contact Current Rating (Max) 3 AMP | Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Thickness .381 MICM | Mating Square Post Dimension .64 MM | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination | Other | 1375583-4 |
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1375583-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 5 | Contact Features: Contact Current Rating (Max) 3 AMP | Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Thickness .381 MICM | Mating Square Post Dimension .64 MM | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination | Other | 1375583-4 |
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5-1375583-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin-Lead | Contact Current Rating (Max) 3 AMP | Contact Base Material Brass | Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .025 INCH | Contact Type Pin | Contact Mating Area Plati | Other | 5-1375583-1 |
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5558342-1
TE Connectivity
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1 | Body Features: PCB Ground Tab Location -.12 INCH | Modular Jack Latch Orientation Standard - Latch Down | Shield Material Copper Alloy | Shield Plating Material Tin | PCB Ground Tab Location -3.05 MM | Connector Profile Low | Configuration Features: PCB Mount Orientation Right Angle | Status Light Type Not Illuminated | Port Matrix Configuration 1 x 1 | Port Configuration Single Port | Number of PCB Ground Tabs 2 | Number of Loaded Positions 6 | Number of Positions 8 | Connector Contact Density Standard | C | Other | 5558342-1 |
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SLG55583AV
Renesas Electronics
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1 | The SLG55583A is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.2 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. The SLG55583A can also support CDP mode (FAST charging and data communication available mode if smartphone can support CDP mode.) The SLG5 | Small Outline No-lead | SLG55583AV |
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5558344-1
TE Connectivity
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1 | Body Features: Shield Plating Material Tin | PCB Ground Tab Location -.12 INCH | Shield Material Copper Alloy | Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location -3.05 MM | Configuration Features: Number of Positions 8 | Number of PCB Ground Tabs 2 | Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Connector Contact Density Standard | Panel Ground Location Top/Bottom | PCB Mount Orientation Right Angle | | Other | 5558344-1 |
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5558341-1
TE Connectivity
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1 | Body Features: Connector Profile Standard | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Status Light Type Not Illuminated | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Loaded Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Connector Contact Density Standard | Contact Features: Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1.5 AMP | Contact Base Materi | Other | 5558341-1 |
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SLG55583V
Renesas Electronics
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1 | The SLG55583 is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.2 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. The SLG55583 can also support CDP mode (FAST charging and data communication available mode if smartphone can support CDP mode.) The SLG555 | Small Outline No-lead | SLG55583V |
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1755833
Phoenix Contact
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1 | PCB header, nominal cross section: 2.5 mm?, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 12, Number of rows: 1, Number of positions per row: 12, number of connections: 12, product range: MSTBVA 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, Stecksystem: CLASSIC COMBICON, Locking: without, type of packaging: packed in cardboard | Other | 1755833 |
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5558341
TE Connectivity
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1 | Modular Jack & Plug Interface Type : RJ45 | Other | 5558341 |
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74435583300
Würth Elektronik
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1 | WURTH ELEKTRONIK - 74435583300 - Power Inductor (SMD), 33 µH, 11.5 A, Shielded, 15 A, WE-HCI Series, 22.5mm x 22mm x 12mm | Inductors Precision Moulded | 74435583300 |
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LTC5583IUF#PBF
Analog Devices
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1 | UF Package 24-Lead Plastic QFN (4mm × 4mm) | Quad Flat No-Lead | LTC5583IUF#PBF |
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HDL6V5583
ABLIC Inc.
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1 | Switch ICs - Various Ultrasound Digital Transmit Pulsers | Other | HDL6V5583 |
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LTC5583IUF#TRPBF
Analog Devices
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1 | RF Detector Matched Dual-Channel 6GHz RMS Power Detector Measures VSWR | Quad Flat No-Lead | LTC5583IUF#TRPBF |
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5558344-1
TE Connectivity
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1 | Body Features: Shield Plating Material Tin | PCB Ground Tab Location -.12 INCH | Shield Material Copper Alloy | Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location -3.05 MM | Configuration Features: Number of Positions 8 | Number of PCB Ground Tabs 2 | Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Connector Contact Density Standard | Panel Ground Location Top/Bottom | PCB Mount Orientation Right Angle | | Other | 5558344-1 |
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1955837
Phoenix Contact
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1 | PCB header, nominal cross section: 2.5 mm?, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 11, Number of rows: 1, Number of positions per row: 11, number of connections: 11, product range: CCV 2,5/..-GF, pitch: 5.08 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, Stecksystem: CLASSIC COMBICON, Locking: Screw locking, type of packaging: 88 mm wide tape, User information and design | Other | 1955837 |
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AD5583YRVZ
Analog Devices
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1 | Quad, Parallel Input, Voltage Output, 10-Bit Digital-to-Analog Converter | Small Outline Packages | AD5583YRVZ |
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1-1735583-1
TE Connectivity
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1 | MSATA, RECEPTACLE, R/A SMT, BTM, 16 position | Other | 1-1735583-1 |
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5558342-1
TE Connectivity
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1 | Body Features: PCB Ground Tab Location -.12 INCH | Modular Jack Latch Orientation Standard - Latch Down | Shield Material Copper Alloy | Shield Plating Material Tin | PCB Ground Tab Location -3.05 MM | Connector Profile Low | Configuration Features: PCB Mount Orientation Right Angle | Status Light Type Not Illuminated | Port Matrix Configuration 1 x 1 | Port Configuration Single Port | Number of PCB Ground Tabs 2 | Number of Loaded Positions 6 | Number of Positions 8 | Connector Contact Density Standard | C | Other | 5558342-1 |
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5558341-1
TE Connectivity
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1 | Body Features: Connector Profile Standard | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Status Light Type Not Illuminated | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Loaded Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Connector Contact Density Standard | Contact Features: Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1.5 AMP | Contact Base Materi | Other | 5558341-1 |
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5558310-1
TE Connectivity
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1 | Body Features: Shield Plating Material Tin | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location -3.05 MM | Shield Material Copper Alloy | Connector Profile Low | PCB Ground Tab Location -.12 INCH | Configuration Features: Port Configuration Single Port | Port Matrix Configuration 1 x 1 | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of PCB Ground Tabs 2 | Connector Contact Density Standard | C | Other | 5558310-1 |
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558-3387-11-00-00-LF
Cambion Electronics Ltd
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1 | Variable Inductor, | 558-3387-11-00-00-LF |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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558-3387-34-00-00
Cambion Electronics Ltd
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1 | Variable Inductor, 26300uH Min, 39500uH Max, Ferrite-Core, Shielded, | 558-3387-34-00-00 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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558-3387-26-00-00-LF
Cambion Electronics Ltd
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1 | Variable Inductor, | 558-3387-26-00-00-LF |
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