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5-794678-0
TE Connectivity
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1 | 20P MICRO MNL ASSY,R/A,THRU,LF | Other | 5-794678-0 |
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TLP5794H(D4-TP,E
Toshiba
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1 | 6A, 4A Gate Driver Optical Coupling 5000Vrms 1 Channel 6-SO | Other | TLP5794H(D4-TP,E |
3
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5-794618-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Mating Area Plating Materi | Other | 5-794618-0 |
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5-794682-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 5-794682-4 |
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1457940
Phoenix Contact
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1 | SACC-DSI-FS-5CON-L180/SH BU - Device connector rear mounting, 5-position, Socket, straight, M12-SPEEDCON, A-coding, Wave soldering, this item is expected to be lead-free from Q2 2026 in accordance with RoHS II without exception 6c (Pb < 0.1%), a lead-free alternative is possible on request in advance | Other | 1457940 |
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5-794630-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 24 | PCB Mount Orientation Vertical | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Materi | Other | 5-794630-4 |
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5-794682-0
TE Connectivity
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1 | 20P MICRO MNL ASSY,VRT,THRU,L | Other | 5-794682-0 |
3
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1357940000
Weidmüller
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1 | PCB connector (board connection), 160 V, 7.9 A, Pitch in mm: 3.50, Number of poles: 24, THT/THR solder connection, Box | Other | 1357940000 |
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5-794636-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 24 | Number of Power Positions 24 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Ty | Other | 5-794636-4 |
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TLP5794H
Toshiba
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1 | Single gate driver photocoupler | Other | TLP5794H |
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1755794
Phoenix Contact
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1 | MSTBVA 2,5/ 8-G-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: MSTBVA 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector patter | Other | 1755794 |
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5-794627-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 24 | Number of Power Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Multiple Contact Types W | Other | 5-794627-4 |
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5-794677-2
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 22 position 0.118" (3.00mm) | Other | 5-794677-2 |
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5-794677-4
TE Connectivity
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1 | Configuration Features: Number of Positions 24 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 24 | Number of Signal Positions 0 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Mater | Other | 5-794677-4 |
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5-794638-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire S | Other | 5-794638-0 |
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5-794630-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types | Other | 5-794630-0 |
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5-794677-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Plating Material Thickne | Other | 5-794677-0 |
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5-794630-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 22 | Number of Positions 22 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contac | Other | 5-794630-2 |
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5-794618-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Platin | Other | 5-794618-2 |
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5-794637-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 22 | Number of Positions 22 | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material G | Other | 5-794637-2 |
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5-794680-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Power, Micro MATE-N-LOK | Other | 5-794680-4 |
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5-794636-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 20 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area | Other | 5-794636-0 |
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5794173-2
TE Connectivity
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1 | CONN HEADER R/A 6POS 4.2MM | Other | 5794173-2 |
2
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5-794632-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 5-794632-4 |
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5-794632-0
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 20 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 5-794632-0 |
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