58604 Model Download Search Results
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SY58604UMG-TR
Microchip
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1 | Buffers & Line Drivers | Small Outline No-lead | SY58604UMG-TR |
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2-1586041-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Layout Matrix | | Header, Receptacle - Right Angle PTH Box | 2-1586041-4 |
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1586041-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.03 â | Other | 1586041-6 |
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2-1586041-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 20 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Matrix | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Layout Inline | | Other | 2-1586041-0 |
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1-1586041-0
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 10 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Header, Receptacle - Right Angle PTH Box | 1-1586041-0 |
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1586040-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Dimensions: Compatible Insula | Other | 1586040-2 |
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1586042-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Contact Type Pin | Dimensions: Compatible Ins | Header, Shrouded - Right Angle PTH Box | 1586042-2 |
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1586041-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Dimension | Other | 1586041-2 |
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1586041-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Retention Within Housing Without | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Layout Square Grid | PCB Contact Termination Area Plating Material | Header, Shrouded - Right Angle PTH Box | 1586041-4 |
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1-1586042-4
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 14 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Other | 1-1586042-4 |
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1-1586041-4
TE Connectivity
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1 | 14P VAL-U-LOK R/A HDR V2 | Header, Receptacle - Right Angle PTH Box | 1-1586041-4 |
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1-1586042-2
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 12 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Header, Receptacle - Right Angle PTH Box | 1-1586042-2 |
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1-1586042-0
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 10 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Other | 1-1586042-0 |
3
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1-1586041-2
TE Connectivity
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1 | 12w r/a pin header | Other | 1-1586041-2 |
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1-1586041-6
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 16 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Header, Shrouded - Right Angle PTH Box | 1-1586041-6 |
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1586041-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Layout Matrix | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Type Pin | Contact Retention Within Housing Without | Contact L | Other | 1586041-8 |
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1-1586041-8
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 18 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Other | 1-1586041-8 |
3
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1586040-8
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 8 Position, 4.2 mm [.165 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Power, Natural | Other | 1586040-8 |
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1586042-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Square Grid | Contact Layout Matrix | Contact Mating Area Plating Material Tin | Contact Cu | Header, Shrouded - Right Angle PTH Box | 1586042-4 |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2-1586042-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Power Positions 24 | Number of Rows 2 | Contact Features: Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Tin | | Other | 2-1586042-4 |
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58604-2
TE Connectivity
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0 | Tool And Machinery | 58604-2 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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58604SL001
Alpha Wire
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1 | Wire And Cable | 58604SL001 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SY58604UMGTR
Microchip Technology Inc
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1 | Low Skew Clock Driver, 58604 Series, 2 True Output(s), 0 Inverted Output(s) | SY58604UMGTR |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SY58604UMG
Micrel Inc
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1 | Low Skew Clock Driver, 58604 Series, 1 True Output(s), 0 Inverted Output(s), QCC8 | SY58604UMG |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SY58604UMG
Microchip Technology Inc
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1 | Low Skew Clock Driver, 58604 Series, 1 True Output(s), 0 Inverted Output(s), QCC8 | SY58604UMG |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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