70L3- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	FBP1604N470L3 Bourns	1	Band Pass LTCC Filter Compact size Low-Temperature Co-fired Ceramic , 4400-5000 MHz , 10 dB min. , 3.0 W max , 200 V , -40 °C ~ +85 °C	Other	FBP1604N470L3	3D model not available Symbol and footprint available 2	1 Download Model
	SPC56EL70L3CBFSR STMicroelectronics	1	 High-performance e200z4d dual core– 32-bit Power Architecture® technologyCPU– Core frequency as high as 120 MHz– Dual issue five-stage pipeline core– Variable Length Encoding (VLE)– Memory Management Unit (MMU)– 4 KB instruction cache with error detectioncode– Signal Processing Engine (SPE) Memory available– 2 MB flash memory with ECC– 192 KB on-chip SRAM with ECC– Built-in RWW capabilities for EEPROMemulation SIL3/ASILD innovative safety concept: Lockstep mode and Fail-s	Quad Flat Packages	SPC56EL70L3CBFSR	3D model available Symbol and footprint available 3	1 Download Model
	SPC564L70L3CBFSR STMicroelectronics	1	32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and safety applications	Quad Flat Packages	SPC564L70L3CBFSR	3D model available Symbol and footprint available 3	1 Download Model
	SPC56EL70L3CBFSY STMicroelectronics	1	32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and safety applications	Quad Flat Packages	SPC56EL70L3CBFSY	3D model available Symbol and footprint available 3	1 Download Model

	FBP2007N470L3 Bourns	1	Band Pass LTCC Filter Compact size Low-Temperature Co-fired Ceramic , 200 V , 3 W max , 50 Ω , -40 ~ +105 °C	Other	FBP2007N470L3	3D model not available Symbol and footprint available 2	1 Download Model
	SPC564L70L3CBFSY STMicroelectronics	1	High-performance e200z4d dual core– 32-bit Power Architecture® technologyCPU– Core frequency as high as 120 MHz– Dual issue five-stage pipeline core– Variable Length Encoding (VLE)– Memory Management Unit (MMU)– 4 KB instruction cache with error detectioncode– Signal Processing Engine (SPE) Memory available– 2 MB flash memory with ECC– 192 KB on-chip SRAM with ECC– Built-in RWW capabilities for EEPROMemulation SIL3/ASILD innovative safety concept: Lockstep mode and Fail-saf	Quad Flat Packages	SPC564L70L3CBFSY	3D model available Symbol and footprint available 3	1 Download Model
	BAS70L,315 Nexperia	1	Nexperia 70V 70mA, Diode, 2-Pin SOD-882 BAS70L,315	Other	BAS70L,315	3D model available Symbol and footprint available 3	1 Download Model
	SPC564L70L3BCOSR STMicroelectronics	1	32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and safety applications	Quad Flat Packages	SPC564L70L3BCOSR	3D model available Symbol and footprint available 3	1 Download Model
	SPC564L70L3BCOSY STMicroelectronics	1	32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and safety applications	Quad Flat Packages	SPC564L70L3BCOSY	3D model available Symbol and footprint available 3	1 Download Model
	70L3-20-11-1-ZB TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-20-11-1-ZB	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-22-13-1-ZB TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-22-13-1-ZB	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-08-06-1-ZB TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-08-06-1-ZB	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-12-06-1-ZB TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-12-06-1-ZB	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-10-06-1-B TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-10-06-1-B	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-11-06-1-ZB TE Connectivity	1	Connector Accessory		70L3-11-06-1-ZB	3D model not available Symbol and footprint not available 0	0 Build or Request

	70L3-18-10-1-C TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-18-10-1-C	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-20-16-1-C TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-20-16-1-C	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-18-10-1-ZB TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-18-10-1-ZB	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-18-08-1-C TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-18-08-1-C	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-28-22-1-ZB TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-28-22-1-ZB	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-28-22-1-C TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-28-22-1-C	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-28-16-1-B TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-28-16-1-B	3D model not available Symbol and footprint not available 0	0 Build or Request
	70L3-10-06-1-ZB TE Connectivity	1	Connector Accessory, Aluminum Alloy		70L3-10-06-1-ZB	3D model not available Symbol and footprint not available 0	0 Build or Request
	IDT6116LA70L32B8 Integrated Device Technology Inc	1	Standard SRAM, 2KX8, 70ns, CMOS, CQCC32		IDT6116LA70L32B8	3D model not available Symbol and footprint not available 0	0 Build or Request
	M470L3223BT0-LA0 Samsung Semiconductor	1	DDR DRAM Module, 32MX64, 0.8ns, CMOS		M470L3223BT0-LA0	3D model not available Symbol and footprint not available 0	0 Build or Request
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