72125 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	72125 Molex	1	Barrier Strip Terminal Block, 20A, 3.31mm2, 1 Row(s), 1 Deck(s)		72125	3D model not available Symbol and footprint not available 0	0 Build or Request
	72125L25SOG Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Small Outline Packages	72125L25SOG	3D model available Symbol and footprint available 3	1 Download Model
	72125L25SO Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Small Outline Packages	72125L25SO	3D model available Symbol and footprint available 3	1 Download Model
	72125L25SO8 Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Small Outline Packages	72125L25SO8	3D model available Symbol and footprint available 3	1 Download Model

	72125L50TP Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Dual-In-Line Packages	72125L50TP	3D model available Symbol and footprint available 3	1 Download Model
	72125L50SO8 Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Small Outline Packages	72125L50SO8	3D model available Symbol and footprint available 3	1 Download Model
	72125L50SO Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Small Outline Packages	72125L50SO	3D model available Symbol and footprint available 3	1 Download Model
	72125L25TP Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Dual-In-Line Packages	72125L25TP	3D model available Symbol and footprint available 3	1 Download Model
	72125L25TPG Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Dual-In-Line Packages	72125L25TPG	3D model available Symbol and footprint available 3	1 Download Model
	72125L25SOG8 Renesas Electronics	1	The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.	Small Outline Packages	72125L25SOG8	3D model available Symbol and footprint available 3	1 Download Model
	44472-1251 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 12 Circuits	Other	44472-1251	3D model available Symbol and footprint available 3	1 Download Model
	44472-1253 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 12 Circuits	Other	44472-1253	3D model available Symbol and footprint available 3	1 Download Model
	44472-1254 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 12 Circuits, PA Polyamide Nylon 6/6 94V-0	Other	44472-1254	3D model available Symbol and footprint available 3	1 Download Model
	44472-1252 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 12 Circuits	Other	44472-1252	3D model available Symbol and footprint available 3	1 Download Model
	44472-1256 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 12 Circuits, PA Polyamide Nylon 6/6 94V-0	Other	44472-1256	3D model available Symbol and footprint available 3	1 Download Model

	44472-1250 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 12 Circuits	Other	44472-1250	3D model available Symbol and footprint available 3	1 Download Model
	44472-1255 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 12 Circuits, PA Polyamide Nylon 6/6 94V-0	Other	44472-1255	3D model available Symbol and footprint available 3	1 Download Model
	44472-1257 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 12 Circuits, PA Polyamide Nylon 6/6 94V-0	Other	44472-1257	3D model available Symbol and footprint available 3	1 Download Model
	72125L50SO Integrated Device Technology Inc	1	FIFO, 1KX16, 50ns, Synchronous, CMOS, PDSO28		72125L50SO	3D model not available Symbol and footprint not available 0	0 Build or Request
	72125L25SO Integrated Device Technology Inc	1	FIFO, 1KX16, 25ns, Synchronous, CMOS, PDSO28		72125L25SO	3D model not available Symbol and footprint not available 0	0 Build or Request
	72125L50TPG Renesas Electronics Corporation	1	FIFO, 1KX16, 50ns, Synchronous, CMOS, PDIP28		72125L50TPG	3D model not available Symbol and footprint not available 0	0 Build or Request
	72125L50TP Integrated Device Technology Inc	1	FIFO, 1KX16, 50ns, Synchronous, CMOS, PDIP28		72125L50TP	3D model not available Symbol and footprint not available 0	0 Build or Request
	72125L25SO8 Integrated Device Technology Inc	1	FIFO, 1KX16, 25ns, Synchronous, CMOS, PDSO28		72125L25SO8	3D model not available Symbol and footprint not available 0	0 Build or Request
	72125L50TPG Integrated Device Technology Inc	1	FIFO, 1KX16, 50ns, Synchronous, CMOS, PDIP28		72125L50TPG	3D model not available Symbol and footprint not available 0	0 Build or Request
	72125L25TP Integrated Device Technology Inc	1	FIFO, 1KX16, 25ns, Synchronous, CMOS, PDIP28		72125L25TP	3D model not available Symbol and footprint not available 0	0 Build or Request
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