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72125L25SOG - Renesas Electronics

Description: The 72125 is a 1K x 16 dedicated, parallel-to-serial FIFOs. The ability to buffer wide word widths (x16) make this FIFO ideal for laser printers, FAX machines, local area networks (LANS), video storage and disk/tape controller applications. Expansion in width and depth can be achieved using multiple chips. IDT's unique serial expansion logic makes this possible using a minimum of pins.

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72125L25SOG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PCG28
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72125L25SOG - Renesas Electronics  - 3D model - Small Outline Packages - PCG28
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72125L25SOG Details

  • Manufacturer Part Number:

    72125L25SOG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    28

  • Manufacturer Package Code:

    PEG28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    46 Weeks, 1 Day

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Memory IC Type:

    OTHER FIFO

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Terminal Finish:

    Matte Tin (Sn)

72125L25SOG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3801EJ0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement, to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The 72125L25SOG also has an internal overcurrent detection feature, but it's limited to a specific threshold and may not be sufficient for all applications.
  • According to Renesas, the maximum allowed voltage on the VCC pin during power-up and power-down sequences is 6.5V. Exceeding this voltage may cause damage to the device.
  • Renesas provides EMC design guidelines in their application note (R01AN3801EJ0100) which include recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure EMC compliance.
  • The recommended operating temperature range for the 72125L25SOG is -40°C to 125°C. However, the device can operate up to 150°C with derating. It's essential to follow the thermal design guidelines to ensure reliable operation within the specified temperature range.

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72125L25SOG Overview

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72125L25SOG Alternates

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Image Part Number Model
Part Image IDT72125L25SOG8 Integrated Device Technology Inc

FIFO, 1KX16, 25ns, Synchronous, CMOS, PDSO28

Part Image 72125L25SO Integrated Device Technology Inc

FIFO, 1KX16, 25ns, Synchronous, CMOS, PDSO28

Part Image IDT72125L25SOG Renesas Electronics Corporation

FIFO, 1KX16, 25ns, Synchronous, CMOS, PDSO28

Part Image IDT72125L25SOG8 Renesas Electronics Corporation

FIFO, 1KX16, 25ns, Synchronous, CMOS, PDSO28

Part Image IDT72125L25SO8 Integrated Device Technology Inc

FIFO, 1KX16, 25ns, Synchronous, CMOS, PDSO28

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