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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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735427-2
TE Connectivity
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1 | Contact Features: Contact Underplating Material Thickness 1.3 MICM | Mating Tab Thickness .79 MM | Contact Mating Area Plating Material Thickness 150 – 397.63 MICIN | Contact Underplating Material Thickness 51.18 MICIN | PCB Contact Termination Area Plating Material Thickness 3.8 – 10.1 MICM | Contact Underplating Material Brass | Contact Mating Area Plating Material Thickness 3.8 – 10.1 MICM | Mating Tab Width 2.79 MM | Terminal Orientation Straight | Terminal Plating Material Tin | PCB Terminal Type | Other | 735427-2 |
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