75-19 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	SLY507519S Fischer Elektronik GmbH & Co. KG	1	Single Row, Male, for PCB interconnections, Pitch 2mm, THT, 19 Position	Other	SLY507519S	3D model available Symbol and footprint available 3	1 Download Model
	SLY507519Z Fischer Elektronik GmbH & Co. KG	1	Single Row, Male, for PCB interconnections, Pitch 2mm, THT, 19 Position	Other	SLY507519Z	3D model available Symbol and footprint available 3	1 Download Model
	SLY507519G Fischer Elektronik GmbH & Co. KG	1	Single Row, Male, for PCB interconnections, Pitch 2mm, THT, 19 Position	Other	SLY507519G	3D model available Symbol and footprint available 3	1 Download Model
	UCC27519DBVT Texas Instruments	1	Texas Instruments UCC27519DBVT, MOSFET Power Driver, 4A, 4.5 → 18 V, Non-Inverting, 5-Pin SOT-23	SOT23 (5-Pin)	UCC27519DBVT	3D model available Symbol and footprint available 3	1 Download Model

	224-1275-19-0602J 3M	1	3M, 2241275 2.54mm Pitch Straight 24 Way, Through Hole ZIF IC Dip Socket, 1A	Other	224-1275-19-0602J	3D model not available Symbol and footprint available 2	1 Download Model
	UCC27519DBVR Texas Instruments	1	4A/4A Single Channel High-Speed Low-side Gate Driver	SOT23 (5-Pin)	UCC27519DBVR	3D model available Symbol and footprint available 3	1 Download Model
	06-675-191T ARIES	1	Headers & Wire Housings DIP PROGRAM HEADERS 6 PINS	Other	06-675-191T	3D model available Symbol and footprint available 3	1 Download Model
	UCC27519AQDBVRQ1 Texas Instruments	1	Single Channel High-Speed, Low-Side Gate Driver Based On CMOS Input Threshold	SOT23 (5-Pin)	UCC27519AQDBVRQ1	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S133BCI8 Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S133BCI8	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S133BF Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S133BF	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S166BF Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S166BF	3D model available Symbol and footprint available 3	1 Download Model
	10167519-121221TLF Amphenol Communications Solutions	1	Minitek® PIC PWROCP, Right Angle Through Hole Hybrid Header (12Power + 12 Signal),30μin Gold plating on contact area and Matte Tin Plating on tail, 2.5mm Tail Length, GW Compatible LCP, Black Color, T&R packing	Other	10167519-121221TLF	3D model available Symbol and footprint available 3	1 Download Model
	1017519 Phoenix Contact	1	TDPT 4/ 6-SC-6,35-ZB - Printed circuit board terminal, nominal current: 41 A, rated voltage (III/2): 1000 V, nominal cross section: 4 mm², number of potentials: 6, number of rows: 1, number of positions per row: 6, product range: TDPT 4/..-SC, pitch: 6.35 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 3.5 mm, number of solder pins	Other	1017519	3D model available Symbol and footprint available 3	1 Download Model
	SLY507519GECO Fischer Elektronik GmbH & Co. KG	1	male header	Other	SLY507519GECO	3D model available Symbol and footprint available 3	1 Download Model
	10167519-060612CLF Amphenol Communications Solutions	1	Minitek® PIC PWROCP, Right Angle Through Hole Hybrid Header (6Power + 6 Signal),15μin Gold plating on contact area and Matte Tin Plating on tail, 3.18mm Tail Length, GW Compatible LCP, Black Color, T&R packing	Other	10167519-060612CLF	3D model available Symbol and footprint available 3	1 Download Model

	70V7519S133BCI Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S133BCI	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S133BFI8 Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S133BFI8	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S166BF8 Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S166BF8	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S166BC8 Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S166BC8	3D model available Symbol and footprint available 3	1 Download Model
	10167519-060621CLF Amphenol Communications Solutions	1	Right Angle Through Hole Hybrid Header (6Power + 6 Signal),30μin Gold plating on contact area and Matte Tin Plating on tail, 2.5mm Tail Length	Other	10167519-060621CLF	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S166BCI Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S166BCI	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S133DRI Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	Quad Flat Packages	70V7519S133DRI	3D model available Symbol and footprint available 3	1 Download Model
	AJW7519 Panasonic	1	1 Form A/1 Form C/2 Form A/2 Form C, 5 A/10 A, Power relays	Other	AJW7519	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S200BC Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S200BC	3D model available Symbol and footprint available 3	1 Download Model
	10167519-121211TLF Amphenol Communications Solutions	1	Minitek® PIC PWROCP, Right Angle Through Hole Hybrid Header (12Power + 12 Signal),30μin Gold plating on contact area and Matte Tin Plating on tail, 3.18mm Tail Length, GW Compatible LCP, Black Color, T&R packing	Other	10167519-121211TLF	3D model available Symbol and footprint available 3	1 Download Model
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