759-5 Model Download Search Results
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759-5
Kings Electronics
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1 | RF Connector Adapter, BNC-BNC, Cable Mount, Male-Male | 759-5 |
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759-5293
Molex
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1 | Molex 50Ω Right Angle PCB Mount, SMA Connector, jack | Other | 759-5293 |
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1827595
Phoenix Contact
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1 | CC 2,5/20-GF-5,08-LR P26THR - PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 20, number of rows: 1, number of positions: 20, number of connections: 20, product range: CC 2,5/..-GF-LR, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB | Other | 1827595 |
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0877595015
Molex
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1 | Milli-Grid Header, Vertical, Surface Mount, 50 Circuits, 0.76µm Gold (Au) Plating, Mating Pin Length 3.80mm, Tube, Lead-Free | Other | 0877595015 |
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MAX17595ATE+T
Analog Devices
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1 | Peak-Current-Mode Controllers for Flyback and Boost Regulators | Quad Flat No-Lead | MAX17595ATE+T |
3
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1759546-1
TE Connectivity
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1 | Configuration Features: Number of Positions 52 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Gold Flash | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | Dimensions: Stack Height 9.9 MM | Stack Height .39 INCH | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .031 INCH | Industry Standards: Bus Type Mini PCI Express | Operation/Application: Circuit Application Signal | Packaging Features: Packa | Other | 1759546-1 |
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350759-5
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Current Ratin | Header, Receptacle - Straight PTH Box | 350759-5 |
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MAX17595ATE+
Analog Devices
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1 | 8V ~ 29V, 100kHz ~ 1MHz, Converter Offline Flyback Topology 100kHz ~ 1MHz 16-TQFN (3x3) | Quad Flat No-Lead | MAX17595ATE+ |
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1759513-1
TE Connectivity
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1 | Board-to-Board, 52 Position, .8 mm [.031 in] Centerline, Stack Height 9 mm [.354 in], Gold Flash, Matte, Tape & Reel, Mini PCI Express & mSATA | Other | 1759513-1 |
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1775954001
Weidmüller
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1 | PCB connector (board connection), 320 V, 27.5 A, Pitch in mm: 5.08, Number of poles: 5, THT/THR solder connection, Tape | Other | 1775954001 |
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0877595076
Molex
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1 | Milli-Grid Header, Vertical, Surface Mount, 50 Circuits, 0.38µm Gold (Au) Plating, Mating Pin Length 3.80mm, with Cap and Pegs, Tube, Lead-Free | Other | 0877595076 |
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75759-5001
Molex
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1 | Small Form-factor Pluggable (SFP) Stacked 2-by-2 Multi-Port Connector with Press-fit PC Tails, 80 Circuits, Lead-Free | Other | 75759-5001 |
3
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2227595-1
TE Connectivity
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1 | I/O Connectors 1X1 VERT ASSY, MINI SAS HD INTERNAL | Other | 2227595-1 |
3
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1727595
Phoenix Contact
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1 | DFK-PC 5/ 3-G-7,62 - Feed-through header, nominal cross section: 6 mm2, color: green, nominal current: 32 A, rated voltage (III/2): 630 V, contact surface: Sn, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: DFK-PC 5/..-G, pitch: 7.62 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4.9 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 5, Pin connector pattern | Other | 1727595 |
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0877595074
Molex
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1 | Milli-Grid Header, Vertical, Surface Mount, 50 Circuits, 0.38µm Gold (Au) Plating, Mating Pin Length 3.80mm, with Cap, Tape and Reel, Lead-Free | Other | 0877595074 |
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0877595051
Molex
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1 | Milli-Grid Header, Vertical, Surface Mount, 50 Circuits, 0.76µm Gold (Au) Plating, Mating Pin Length 3.80mm, with Pegs, Tube, Lead-Free | Other | 0877595051 |
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1975950000
Weidmüller
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1 | PCB connector (board connection), 160 V, 17.5 A, Pitch in mm: 3.81, Number of poles: 11, THT solder connection, Box | Other | 1975950000 |
3
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1775952001
Weidmüller
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1 | PCB connector (board connection), 320 V, 27.5 A, Pitch in mm: 5.08, Number of poles: 5, THT/THR solder connection, Box | Other | 1775952001 |
3
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0877595276
Molex
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1 | Milli-Grid Header, Vertical, Surface Mount, 8 Circuits, 0.38µm Gold (Au) Plating, Mating Pin Length 3.80mm, with Cap and Pegs, Tube, Lead-Free | Other | 0877595276 |
3
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32207595
Yageo Group
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1 | Board Mount Temperature Sensors SMD1206(V) Pt 1000 Class B -50 to +130C | Thermistors Chip | 32207595 |
3
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0877595064
Molex
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1 | Milli-Grid Header, Vertical, Surface Mount, 50 Circuits, 0.38µm Gold (Au) Plating, Mating Pin Length 3.80mm, with Cap, Tube, Lead-Free | Other | 0877595064 |
3
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0877595075
Molex
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1 | Milli-Grid Header, Vertical, Surface Mount, 50 Circuits, 0.76µm Gold (Au) Plating, Mating Pin Length 3.80mm, with Cap, Tape and Reel, Lead-Free | Other | 0877595075 |
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1875950000
Weidmüller
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1 | PCB terminal, 160 V, 17.5 A, Pitch in mm: 3.81, 1.5 mm², Number of poles: 5, PUSH IN with push button, THT/THR solder connection, 90°, Tape | Other | 1875950000 |
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1759547-1
TE Connectivity
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1 | Configuration Features: Number of Positions 52 | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Finish Matte | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold Flash | Dimensions: Stack Height 7 MM | Stack Height .276 INCH | Housing Features: Centerline (Pitch) .031 INCH | Centerline (Pitch) .8 MM | Industry Standards: Bus Type Mini PCI Express | Operation/Application: Circuit Application Signal | Packaging Features: Packag | Other | 1759547-1 |
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759-50.000MHZ-DM0
Fox Electronics
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1 | HCMOS Output Clock Oscillator, 50MHz Nom | 759-50.000MHZ-DM0 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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