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794637-6
TE Connectivity
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1 | Connector Header Surface Mount 6 position 0.118" (3.00mm) | Other | 794637-6 |
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4-1879463-5
TE Connectivity
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1 | RL73H 2E R68 1% 1K RL | Resistor Chip | 4-1879463-5 |
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3-794636-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Curren | Other | 3-794636-4 |
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3-794636-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | P | Other | 3-794636-2 |
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4-794631-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 16 | Number of Positions 16 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickne | Other | 4-794631-6 |
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4-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794630-2 |
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3-794638-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Positions 4 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 A | Other | 3-794638-4 |
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3-794635-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Rows 2 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Pla | Other | 3-794635-6 |
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4-794630-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickn | Other | 4-794630-6 |
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5-794636-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 24 | Number of Power Positions 24 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Ty | Other | 5-794636-4 |
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3-794632-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material T | Other | 3-794632-8 |
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5-794638-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire S | Other | 5-794638-0 |
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BFC247946304
Vishay
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1 | MKP 300nF 5% 250Vdc Pitch 7,5mm | Other | BFC247946304 |
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3-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | C | Header, Receptacle - Straight PTH Box | 3-794630-2 |
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5-794630-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 24 | PCB Mount Orientation Vertical | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Materi | Other | 5-794630-4 |
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3-794632-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Multiple Con | Header, Shrouded - Straight PTH Box | 3-794632-2 |
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3-794630-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 8 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Platin | Header, Shrouded - Straight PTH Box | 3-794630-8 |
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4-794633-0
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 10 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOKr | Other | 4-794633-0 |
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1-794638-0
TE Connectivity
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1 | Pin & Socket Connectors HDR ASSY 10 POS 30AU VERT SMT | Other | 1-794638-0 |
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4-794631-2
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 12 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Multiple Contact Types Without | Dimensions: PCB Th | Header, Receptacle - Straight PTH Box | 4-794631-2 |
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4-794631-4
TE Connectivity
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1 | 14P MICRO MNL ASSY,VRT,HDR LF | Other | 4-794631-4 |
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4-794632-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | Header, Receptacle - Straight PTH Box | 4-794632-6 |
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3-794631-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICI | Other | 3-794631-4 |
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1794630000
Weidmüller
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1 | PCB plug-in connector, male header, closed side, THT/THR solder connection, 3.50 mm, Number of poles: 26, 180°, Solder pin length: 3.5 mm, tinned, black, Box | Other | 1794630000 |
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4-794630-0
TE Connectivity
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1 | Configuration Features: Number of Positions 10 | Number of Rows 2 | Number of Power Positions 10 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Curr | Other | 4-794630-0 |
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