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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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794637-6
TE Connectivity
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1 | Connector Header Surface Mount 6 position 0.118" (3.00mm) | Other | 794637-6 |
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4-794636-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 18 | Number of Power Positions 18 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | | Other | 4-794636-8 |
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4-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794630-2 |
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5-794636-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 24 | Number of Power Positions 24 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Ty | Other | 5-794636-4 |
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5-794638-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire S | Other | 5-794638-0 |
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5-794638-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire S | Other | 5-794638-0 |
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3-794632-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material T | Other | 3-794632-8 |
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3-794638-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Positions 4 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 A | Other | 3-794638-4 |
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3-794631-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 8 | Number of Rows 2 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Cont | Header, Receptacle - Straight PTH Box | 3-794631-8 |
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4-794630-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickn | Other | 4-794630-6 |
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4-794632-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Rows 2 | Number of Positions 10 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Ma | Header, Shrouded - Straight PTH Box | 4-794632-0 |
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4-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794630-2 |
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3-794635-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Rows 2 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Pla | Other | 3-794635-6 |
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4-794637-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 10 | Number of Rows 2 | Number of Power Positions 10 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type | Other | 4-794637-0 |
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BFC247946304
Vishay
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1 | MKP 300nF 5% 250Vdc Pitch 7,5mm | Other | BFC247946304 |
3
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5-794630-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 24 | PCB Mount Orientation Vertical | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Materi | Other | 5-794630-4 |
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5-794630-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types | Other | 5-794630-0 |
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3-794630-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 8 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Platin | Header, Shrouded - Straight PTH Box | 3-794630-8 |
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4-794631-2
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 12 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Multiple Contact Types Without | Dimensions: PCB Th | Header, Receptacle - Straight PTH Box | 4-794631-2 |
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5-794636-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 20 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area | Other | 5-794636-0 |
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4-794632-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | Header, Receptacle - Straight PTH Box | 4-794632-6 |
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3-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | C | Header, Receptacle - Straight PTH Box | 3-794630-2 |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-794630-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 8 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Platin | Header, Shrouded - Straight PTH Box | 3-794630-8 |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-794632-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Multiple Con | Header, Shrouded - Straight PTH Box | 3-794632-2 |
3
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4-794631-4
TE Connectivity
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1 | 14P MICRO MNL ASSY,VRT,HDR LF | Other | 4-794631-4 |
3
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