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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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794680-8
TE Connectivity
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1 | CONN HEADER VERT 8POS 3MM | Other | 794680-8 |
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3-794680-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 8 | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Mate | Other | 3-794680-8 |
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1-794681-4
TE Connectivity
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1 | CONN HEADER VERT 14POS 3MM | Other | 1-794681-4 |
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1-794680-8
TE Connectivity
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1 | Pin & Socket Connectors 18POS MICRO MNL ASSY VRT,THRU | Other | 1-794680-8 |
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1-794682-0
TE Connectivity
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1 | CONN HEADER VERT 10POS 3MM | Other | 1-794682-0 |
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3-794680-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 2 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickne | Other | 3-794680-4 |
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4-794681-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Rows 2 | Number of Signal Positions 0 | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Mat | Other | 4-794681-0 |
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3-794680-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area | Other | 3-794680-2 |
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4-794680-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 16 | PCB Mount Orientation Vertical | Number of Power Positions 16 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mati | Other | 4-794680-6 |
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3-794681-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickn | Other | 3-794681-4 |
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5-794682-0
TE Connectivity
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1 | 20P MICRO MNL ASSY,VRT,THRU,L | Other | 5-794682-0 |
3
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4-794680-4
TE Connectivity
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1 | Configuration Features: Number of Positions 14 | Number of Power Positions 14 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794680-4 |
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4-794681-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 12 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rati | Other | 4-794681-2 |
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4-794682-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 4.81 MICM | Contact Retention Within Housing Without | Contact | Other | 4-794682-0 |
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3-794681-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 8 | Number of Power Positions 8 | Number of Rows 2 | Contact Features: Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .38 MICM | Contact Ma | Other | 3-794681-8 |
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4-794682-8
TE Connectivity
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1 | 18P MICRO MNL ASSY,VRT,THRU,L | Other | 4-794682-8 |
3
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4-794682-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 12 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Through Hole - Solder, Micro MATE-N-LOK | Other | 4-794682-2 |
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3-794680-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types | Other | 3-794680-6 |
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3-794682-8
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 8 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Power, Micro MATE-N-LOK | Other | 3-794682-8 |
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5-794682-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 5-794682-4 |
3
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3-794682-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area | Other | 3-794682-4 |
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4-794680-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | | Other | 4-794680-2 |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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4-794680-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Ma | Other | 4-794680-0 |
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4-794680-8
TE Connectivity
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1 | Pin & Socket Connectors 18P MICRO MNL ASSY VRT,THRU LF | Other | 4-794680-8 |
3
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3-794681-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Materi | Other | 3-794681-2 |
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