839-2 Model Download Search Results
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839-22-008-30-001101
Mill-Max
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1 | Conn Spring Loaded Connector HDR 8 POS 2.54mm Solder ST SMD Bulk | Other | 839-22-008-30-001101 |
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839-22-020-30-001101
Mill-Max
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1 | Conn Spring Loaded Connector HDR 20 POS 2.54mm Solder ST Top Entry SMD Bulk 2.08mm | Other | 839-22-020-30-001101 |
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839-22-010-30-001101
Mill-Max
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1 | Headers & Wire Housings .100" SMT 3mm Stroke Spring Conn, dbl | Other | 839-22-010-30-001101 |
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839-22-012-30-001101
Mill-Max
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1 | Headers & Wire Housings .100" SMT 3mm Stroke Spring Conn, dbl | Other | 839-22-012-30-001101 |
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839-22-020-10-001101
Mill-Max
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1 | 20 Position PCB Mount Spring-Loaded Header Vertical Mount Through-Hole, Double Row 2000HZ , -55°C ~ +125°C | Other | 839-22-020-10-001101 |
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839-22-012-10-001101
Mill-Max
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1 | Circuit Board Hardware - PCB 3 mm stoke, double row, through-hole, spring-loaded connector 12 Pin | Other | 839-22-012-10-001101 |
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282839-2
TE Connectivity
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1 | Body Features: Primary Product Color Green | Product Orientation Vertical | Configuration Features: Stacked Levels Without | Wire Entry Angle 90° | Number of Rows 1 | Number of Positions 2 | Wire Entry Location Side | Contact Features: Contact Current Rating (Max) 13.5 AMP | Contact Base Material Brass | Contact Mating Area Plating Material Tin | Dimensions: Wire Size 30 – 16 AWG | Wire Size .05 – 1.4 MMSQ | Electrical Characteristics: Operating Voltage 750 VAC | Housing Features: Housing Material PA 6 | Other | 282839-2 |
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0483920003
Molex
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1 | Conn USB 3.0 Type A RCP 9 POS 2mm/2.5mm Solder RA Thru-Hole 9 Terminal 1 Port T/R | Other | 0483920003 |
2
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AS183-92LF
Skyworks
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1 | RF Switch ICs .3-2500MHz IL .3dB IP3 +43dBm | SOT23 (6-Pin) | AS183-92LF |
3
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EXBU38392JV
Panasonic
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1 | Series/Type: Anti-Sulfurated Chip Resistor Array, Power Rating (W): 0.063, Chip Size (LxW) (mm): 3.2 X 1.6, Resistance Values (Ω): 3900, Resistance Tolerance (%): 5, Terminal Pitch (mm): 0.8, Type of Circuit: Isolated Circuit, Number of Elements (piece): 4, T.C.R (×10⁻⁶/K): ±200, Number of Terminals (piece): 8 | Other | EXBU38392JV |
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B32672L8392J189
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0039uF, 2000V DC, 5mm(W) x 10.5mm(H) x 18mm(L) | Other | B32672L8392J189 |
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B32672L8392K000
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0039uF, 2000V DC, 5mm(W) x 10.5mm(H) x 18mm(L) | Other | B32672L8392K000 |
3
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EXB-U38392JV
Panasonic
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1 | Series/Type: Anti-Sulfurated Chip Resistor Array, Power Rating (W): 0.063, Chip Size (LxW) (mm): 3.2 X 1.6, Resistance Values (Ω): 3900, Resistance Tolerance (%): 5, Terminal Pitch (mm): 0.8, Type of Circuit: Isolated Circuit, Number of Elements (piece): 4, T.C.R (×10⁻⁶/K): ±200, Number of Terminals (piece): 8 | Other | EXB-U38392JV |
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EXB-U28392JX
Panasonic
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1 | Series/Type: Anti-Sulfurated Chip Resistor Array, Power Rating (W): 0.063, Chip Size (LxW) (mm): 2.0 X 1.0, Resistance Values (Ω): 3900, Resistance Tolerance (%): 5, Terminal Pitch (mm): 0.5, Type of Circuit: Isolated Circuit, Number of Elements (piece): 4, T.C.R (×10⁻⁶/K): ±200, Number of Terminals (piece): 8 | Other | EXB-U28392JX |
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48392-0003
Molex
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1 | MOLEX - 48392-0003. - USB CONN, 3.0 TYPE A, RECP, 9 POS, THT | Other | 48392-0003 |
3
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78Q8392LA03-28CH/F
Analog Devices
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1 | 78Q8392LA03-28CH/F, Ethernet Transceiver IEEE 802.3 Maximum of -10 V, 28-Pin PLCC | Plastic Leaded Chip Carrier | 78Q8392LA03-28CH/F |
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78Q8392L-28CH/F
Analog Devices
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1 | Ethernet ICs 10Base2/5 ETHERNET COAXIAL XCVR | Plastic Leaded Chip Carrier | 78Q8392L-28CH/F |
2
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LT8392HFE#TRPBF
Analog Devices
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1 | 60V Synchronous 4-Switch Buck-Boost Controller with Spread Spectrum | Small Outline Packages | LT8392HFE#TRPBF |
3
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B32642B8392K289
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0039uF, 2000V DC, 5mm(W) x 10.5mm(H) x 18mm(L) | Other | B32642B8392K289 |
3
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1839208
Phoenix Contact
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1 | PTSM 0,5/ 3-HV0-2,5-SMD WH R44 - PCB headers, nominal cross section: 0.5 mm2, color: signal white, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: PTSM 0,5/..-HV-SMD WH, pitch: 2.5 mm, mounting: SMD soldering, pin layout: Linear pad geometry, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern a | Other | 1839208 |
3
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LT8392EFE#PBF
Analog Devices
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1 | 60V Synchronous 4-Switch Buck-Boost Controller with Spread Spectrum | Small Outline Packages | LT8392EFE#PBF |
3
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EXBU28392JX
Panasonic
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1 | Series/Type: Anti-Sulfurated Chip Resistor Array, Power Rating (W): 0.063, Chip Size (LxW) (mm): 2.0 X 1.0, Resistance Values (Ω): 3900, Resistance Tolerance (%): 5, Terminal Pitch (mm): 0.5, Type of Circuit: Isolated Circuit, Number of Elements (piece): 4, T.C.R (×10⁻⁶/K): ±200, Number of Terminals (piece): 8 | Other | EXBU28392JX |
3
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EXB-U18392JX
Panasonic
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1 | Series/Type: Anti-Sulfurated Chip Resistor Array, Power Rating (W): 0.031, Chip Size (LxW) (mm): 1.4 X 0.6, Resistance Values (?): 3900, Resistance Tolerance (%): 5, Terminal Pitch (mm): 0.4, Type of Circuit: Isolated Circuit, Number of Elements (piece): 4, T.C.R (?108/K): ?200, Number of Terminals (piece): 8 | Other | EXB-U18392JX |
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LT8392EUFD#TRPBF
Analog Devices
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1 | 60V Synchronous 4-Switch Buck-Boost Controller with Spread Spectrum | Quad Flat No-Lead | LT8392EUFD#TRPBF |
3
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193839-2
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | PCB Mount Orientation Right Angle | Number of Rows 0 | Contact Features: Contact Mating Area Plating Material Thickness 5.08 MICM | Contact Current Rating (Max) 36 AMP | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Silver | Contact Mating Area Plating Material Thickness 200 MICIN | Contact Type Socket | PCB Contact Termination Area Plating Material Thickness 200 MICIN | Contact Mating Area Pla | Other | 193839-2 |
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![Part Image](["https://componentsearchengine.com/Images/9/839-22-008-30-001101.jpg",null,null])
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