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R5F212AASDFA#V2
Renesas Electronics
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1 | The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Quad Flat Packages | R5F212AASDFA#V2 |
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R5F212BASDFP#V2
Renesas Electronics
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1 | The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp | Quad Flat Packages | R5F212BASDFP#V2 |
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R5F212DASDFP#V2
Renesas Electronics
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1 | The R8C/2D Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2C Group and R8C/2D Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp | Quad Flat Packages | R5F212DASDFP#V2 |
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R5F2136ASDFP#30
Renesas Electronics
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1 | The R8C/36T-A Group is supported only for customers who have already adopted these products. The RX130 Group is recommended for new designs.The R8C/36T-A Group of single-chip microcontrollers (MCUs) incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.Power consumption is low, and additional | Quad Flat Packages | R5F2136ASDFP#30 |
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R5F212AASDFP#V2
Renesas Electronics
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1 | The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Quad Flat Packages | R5F212AASDFP#V2 |
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R5F2138ASDFP#30
Renesas Electronics
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1 | The R8C/38T-A Group of single-chip MCUs incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency.The R8C/38T-A Group of single-chip microcontrollers (MCUs) incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.Power consumption is low, and additio | Quad Flat Packages | R5F2138ASDFP#30 |
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R5F212CASDFP#V2
Renesas Electronics
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1 | The R8C/2C Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp | Quad Flat Packages | R5F212CASDFP#V2 |
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R5F212BASDFA#V2
Renesas Electronics
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1 | The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp | Quad Flat Packages | R5F212BASDFA#V2 |
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A17501POKA-SDFUYJE
Allegro Microsystems
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1 | Dual Output Differential Speed and Direction Sensor IC | Other | A17501POKA-SDFUYJE |
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DSS14UTR
SMC Diode Solutions
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1 | f | Small Outline Diode Flat Lead | DSS14UTR |
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SCLF-10.7+
Mini-Circuits
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1 | f | Other | SCLF-10.7+ |
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RK818-3
Rockchip
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1 | f | Quad Flat No-Lead | RK818-3 |
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FP6290
FEEL
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0 | f | Small Outline Packages | FP6290 |
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TP4056-42-ESOP8
NanJing Top Power
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1 | f | Small Outline Packages | TP4056-42-ESOP8 |
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RP509Z002D
Nisshinbo
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1 | F | BGA | RP509Z002D |
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CH7101B
Chrontel
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1 | f | Quad Flat No-Lead | CH7101B |
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RN55D9000FRE6
Vishay
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1 | f | Resistors, Axial Diameter Horizontal Mounting | RN55D9000FRE6 |
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09673626801
HARTING
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1 | F | Other | 09673626801 |
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C1005CH1H150JT
TDK
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1 | f | Capacitor Chip Non-polarised | C1005CH1H150JT |
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RG1608N-470-W-T1
Susumu
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1 | f | Resistor Chip | RG1608N-470-W-T1 |
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NLV25T-100J-PFM
TDK
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1 | f | Inductor Moulded | NLV25T-100J-PFM |
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RMC1/16SK2002FTH
Kamaya
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1 | f | Resistor Chip | RMC1/16SK2002FTH |
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AC0402FR-07205KL
Yageo Group
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1 | f | Resistor Chip | AC0402FR-07205KL |
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CYPD3177-24LQXI
Infineon
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1 | f | Quad Flat No-Lead | CYPD3177-24LQXI |
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RC1206FR-071K43L
Yageo Group
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1 | YAGEO RC1206 F | Resistor Chip | RC1206FR-071K43L |
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