C-551 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	C-551UB-NW G/W Paralight	1	0.56 INCH SINGLE DIGIT DISPLAY	Dual-In-Line Sockets	C-551UB-NW G/W	3D model not available Symbol and footprint available 2	1 Download Model
	C-551SRD-NW B/W Paralight	1	0.56 Inch Single Digit Display	Dual-In-Line Sockets	C-551SRD-NW B/W	3D model not available Symbol and footprint available 2	1 Download Model
	LPC5514JBD64 NXP	1	32-bit Arm Cortex®-M33, TrustZone, PRINCE, CASPER, 96 KB\r\nSRAM; 256 KB flash, USB HS, Flexcomm Interface, CAN FD,\r\n32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0\r\nMsamples/sec ADC, Comparator, Temperature Sensor, AES,	Quad Flat Packages	LPC5514JBD64	3D model available Symbol and footprint available 3	1 Download Model
	TMS320C5515AZCHA12 Texas Instruments	1	Fixed-Point Digital Signal Processor	BGA	TMS320C5515AZCHA12	3D model available Symbol and footprint available 3	1 Download Model

	TLC5510INSR Texas Instruments	1	8-Bit, 20-MSPS Analog-to-Digital Converter (ADC) with 2-Vpp input	Small Outline Packages	TLC5510INSR	3D model available Symbol and footprint available 3	1 Download Model
	LC5512MV-75Q208C Lattice Semiconductor	1	IC CPLD 512MC 7.5NS 208QFP	Quad Flat Packages	LC5512MV-75Q208C	3D model available Symbol and footprint available 3	1 Download Model
	LC5512MV-45F484C Lattice Semiconductor	1	CPLD ispXPLD 5000MV Family 150K Gates 512 Macro Cells 275MHz 3.3V 484-Pin BGA	BGA	LC5512MV-45F484C	3D model available Symbol and footprint available 3	1 Download Model
	TMS320VC5510AZGWA1 Texas Instruments	1	Fixed-Point Digital Signal Processors	BGA	TMS320VC5510AZGWA1	3D model not available Symbol and footprint available 2	1 Download Model
	LPC5516JEV98 NXP	1	LPC5516JEV98	BGA	LPC5516JEV98	3D model available Symbol and footprint available 3	1 Download Model
	LPC5516JBD64 NXP	1	LPC551x/S1x: Baseline Arm® Cortex®-M33-Based Microcontroller Family	Quad Flat Packages	LPC5516JBD64	3D model available Symbol and footprint available 3	1 Download Model
	BC55-16PA-QX Nexperia	1	60 V, 1 A NPN medium power transistors	Other	BC55-16PA-QX	3D model available Symbol and footprint available 3	1 Download Model
	HC55185CIMZ Renesas Electronics	1	The RSLIC-VoIP family of Ringing Subscriber Line Interface Circuits (RSLIC) supports analog Plain Old Telephone Service (POTS) in short and medium loop length, wireless and wireline applications. Ideally suited for remote subscriber units, this family of products offers flexibility to designers with high ringing voltage and low power consumption system requirements. The RSLIC-VoIP family operates to 100V which translates directly to the amount of ringing voltage supplied to the end subscriber. With the high	Plastic Leaded Chip Carrier	HC55185CIMZ	3D model not available Symbol and footprint available 2	1 Download Model
	SPC5515SBMLQ66 NXP	1	LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body.	Quad Flat Packages	SPC5515SBMLQ66	3D model available Symbol and footprint available 3	1 Download Model
	SPC5517EAMLU66 NXP	1	Microcontroller	Quad Flat Packages	SPC5517EAMLU66	3D model available Symbol and footprint available 3	1 Download Model
	LPC5514JBD100E NXP	1	ARM Microcontrollers - MCU High Efficiency Arm Cortex-M33-based Microcontroller	Quad Flat Packages	LPC5514JBD100E	3D model available Symbol and footprint available 3	1 Download Model

	LPC5516JBD100 NXP	1	LPC5516JBD100	Quad Flat Packages	LPC5516JBD100	3D model available Symbol and footprint available 3	1 Download Model
	HC55130IBZ Renesas Electronics	1	Telecom Interface ICs LW PWR SLIC 63DB BALANCE	Small Outline Packages	HC55130IBZ	3D model available Symbol and footprint available 3	1 Download Model
	TMS320VC5510AZGW2 Texas Instruments	1	Texas Instruments TMS320VC5510AZGW2, 32bit Digital Signal Processor 200MHz 32 kB EPROM 240-Pin BGA	BGA	TMS320VC5510AZGW2	3D model available Symbol and footprint available 3	1 Download Model
	TC5516AP-2 Toshiba	1	2048 WORD x 8 BIT CMOS STATIC RAM	Dual-In-Line Packages	TC5516AP-2	3D model available Symbol and footprint available 3	1 Download Model
	TC5516APL/-2 Toshiba	1	MOS Memory, 2048 x 8 BIT CMOS STATIS RAM, DIP	Dual-In-Line Packages	TC5516APL/-2	3D model available Symbol and footprint available 3	1 Download Model
	LTC5510IUF#PBF Analog Devices	1	LINEAR TECHNOLOGY - LTC5510IUF#PBF - IC, ACTIVE MIXER, 1MHZ - 6GHZ, 16QFN	Quad Flat No-Lead	LTC5510IUF#PBF	3D model available Symbol and footprint available 3	1 Download Model
	NTHC5513T1G onsemi This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Small Size, 40% Smaller than TSOP-6 Package; Leadless SMD Package Featuring Complementary Pair; ChipFET™ Package Provides Great Thermal Characteristics Similar to Larger Packages; Low RDS(on) in a ChipFET™ Package for High Efficiency Performance; Low Profile (< 1.1 mm) Allows Placement in Extremely Thin Environments such as Portable Electronics; Complentary N-Channel and P-Channel MOSFET; RoHS Compliant	SO Transistor Flat Lead	NTHC5513T1G	3D model available Symbol and footprint available 3	1 Download Model
	HC55185CIMZ96 Renesas Electronics	1	The RSLIC-VoIP family of Ringing Subscriber Line Interface Circuits (RSLIC) supports analog Plain Old Telephone Service (POTS) in short and medium loop length, wireless and wireline applications. Ideally suited for remote subscriber units, this family of products offers flexibility to designers with high ringing voltage and low power consumption system requirements. The RSLIC-VoIP family operates to 100V which translates directly to the amount of ringing voltage supplied to the end subscriber. With the high	Plastic Leaded Chip Carrier	HC55185CIMZ96	3D model not available Symbol and footprint available 2	1 Download Model
	HC55185ECMZ96 Renesas Electronics	1	The RSLIC-VoIP family of Ringing Subscriber Line Interface Circuits (RSLIC) supports analog Plain Old Telephone Service (POTS) in short and medium loop length, wireless and wireline applications. Ideally suited for remote subscriber units, this family of products offers flexibility to designers with high ringing voltage and low power consumption system requirements. The RSLIC-VoIP family operates to 100V which translates directly to the amount of ringing voltage supplied to the end subscriber. With the high	Plastic Leaded Chip Carrier	HC55185ECMZ96	3D model not available Symbol and footprint available 2	1 Download Model
	LPC5516JBD64K NXP	1	ARM Microcontrollers - MCU High Efficiency Arm Cortex-M33-based Microcontroller	Quad Flat Packages	LPC5516JBD64K	3D model available Symbol and footprint available 3	1 Download Model
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