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R5F211A3DSP
Renesas Electronics
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1 | D | Small Outline Packages | R5F211A3DSP |
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R5F211A4SP#U0
Renesas Electronics
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1 | The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp | Small Outline Packages | R5F211A4SP#U0 |
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R5F211A2SP#U0
Renesas Electronics
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1 | The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp | Small Outline Packages | R5F211A2SP#U0 |
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R5F211A4DSP#U0
Renesas Electronics
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1 | The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp | Small Outline Packages | R5F211A4DSP#U0 |
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MICRF211AYQS-TR
Microchip
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1 | - RF Receiver ASK, OOK 380MHz ~ 450MHz -110dBm 10kbps PCB, Surface Mount 16-QSOP | Small Outline Packages | MICRF211AYQS-TR |
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R5F211A1SP#U0
Renesas Electronics
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1 | The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp | Small Outline Packages | R5F211A1SP#U0 |
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F211AG473R250P
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 250V, 2.5% +Tol, 2.5% -Tol, 0.047uF, Through Hole Mount | F211AG473R250P |
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F211AG274M050P
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 50V, 20% +Tol, 20% -Tol, 0.27uF, Through Hole Mount | F211AG274M050P |
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F211AG123M250ALG5C
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 250V, 20% +Tol, 20% -Tol, 0.012uF, Through Hole Mount | F211AG123M250ALG5C |
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F211AG683R063C
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 63V, 2.5% +Tol, 2.5% -Tol, 0.068uF, Through Hole Mount | F211AG683R063C |
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F211AG472M100C
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 100V, 20% +Tol, 20% -Tol, 0.0047uF, Through Hole Mount | F211AG472M100C |
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F211AP564K100XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 100V, 10% +Tol, 10% -Tol, 0.56uF, Through Hole Mount, 5124 | F211AP564K100XLTF1 |
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F211AG183J400P
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 400V, 5% +Tol, 5% -Tol, 0.018uF, Through Hole Mount | F211AG183J400P |
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F211AG393K050XLAF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 50V, 10% +Tol, 10% -Tol, 0.039uF, Through Hole Mount | F211AG393K050XLAF1 |
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F211AG224K100XLAF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 100V, 10% +Tol, 10% -Tol, 0.22uF, Through Hole Mount | F211AG224K100XLAF1 |
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F211AG562M063P
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 63V, 20% +Tol, 20% -Tol, 0.0056uF, Through Hole Mount | F211AG562M063P |
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F211AG822R250XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 250V, 2.5% +Tol, 2.5% -Tol, 0.0082uF, Through Hole Mount | F211AG822R250XLTF1 |
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F211AG563M063ALG5C
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 63V, 20% +Tol, 20% -Tol, 0.056uF, Through Hole Mount | F211AG563M063ALG5C |
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F211AP105K063C
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 63V, 10% +Tol, 10% -Tol, 1uF, Through Hole Mount | F211AP105K063C |
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F211AP683K400C
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 400V, 10% +Tol, 10% -Tol, 0.068uF, Through Hole Mount | F211AP683K400C |
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F211AG272M400L
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 400V, 20% +Tol, 20% -Tol, 0.0027uF, Through Hole Mount | F211AG272M400L |
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F211AP824M063L
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 63V, 20% +Tol, 20% -Tol, 0.82uF, Through Hole Mount | F211AP824M063L |
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F211AG682H250XLAF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 250V, 2.5% +Tol, 2.5% -Tol, 0.0068uF, 5116 | F211AG682H250XLAF1 |
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F211AG184R050P
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 50V, 2.5% +Tol, 2.5% -Tol, 0.18uF, Through Hole Mount | F211AG184R050P |
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F211AG332K250ALG5C
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulfide, 250V, 10% +Tol, 10% -Tol, 0.0033uF, Through Hole Mount | F211AG332K250ALG5C |
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