F211A Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F211A3DSP Renesas Electronics	1	D	Small Outline Packages	R5F211A3DSP	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A4SP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A4SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A2SP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A2SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A4DSP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A4DSP#U0	3D model available Symbol and footprint available 3	1 Download Model

	MICRF211AYQS-TR Microchip	1	- RF Receiver ASK, OOK 380MHz ~ 450MHz -110dBm 10kbps PCB, Surface Mount 16-QSOP	Small Outline Packages	MICRF211AYQS-TR	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A1SP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A1SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	F211AG272J063XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 5% +Tol, 5% -Tol, 0.0027uF, Through Hole Mount		F211AG272J063XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG333R250C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 250V, 2.5% +Tol, 2.5% -Tol, 0.033uF, Through Hole Mount		F211AG333R250C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG273M250XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 250V, 20% +Tol, 20% -Tol, 0.027uF, Through Hole Mount		F211AG273M250XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG104K100ALG5C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 100V, 10% +Tol, 10% -Tol, 0.1uF, Through Hole Mount		F211AG104K100ALG5C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG153H400XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulphide, 400V, 2.5% +Tol, 2.5% -Tol, 0.015uF, 5116		F211AG153H400XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG473R050XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 50V, 2.5% +Tol, 2.5% -Tol, 0.047uF, Through Hole Mount		F211AG473R050XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG393K063P KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 10% +Tol, 10% -Tol, 0.039uF, Through Hole Mount		F211AG393K063P	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG683K063P KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 10% +Tol, 10% -Tol, 0.068uF, Through Hole Mount		F211AG683K063P	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AK105M050C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 50V, 20% +Tol, 20% -Tol, 1uF, Through Hole Mount		F211AK105M050C	3D model not available Symbol and footprint not available 0	0 Build or Request

	F211AG123J050P KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 50V, 5% +Tol, 5% -Tol, 0.012uF, Through Hole Mount		F211AG123J050P	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG272K050ALG5C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 50V, 10% +Tol, 10% -Tol, 0.0027uF, Through Hole Mount		F211AG272K050ALG5C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG563H050XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulphide, 50V, 2.5% +Tol, 2.5% -Tol, 0.056uF, 5116		F211AG563H050XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG333J100XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 100V, 5% +Tol, 5% -Tol, 0.033uF, Through Hole Mount		F211AG333J100XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG392K063L KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 10% +Tol, 10% -Tol, 0.0039uF, Through Hole Mount		F211AG392K063L	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG273M100XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulphide, 100V, 20% +Tol, 20% -Tol, 0.027uF, Through Hole Mount, 5116		F211AG273M100XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG154H100XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulphide, 100V, 2.5% +Tol, 2.5% -Tol, 0.15uF, 5116		F211AG154H100XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG472J063ALG5C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 5% +Tol, 5% -Tol, 0.0047uF, Through Hole Mount		F211AG472J063ALG5C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG392M400L KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 400V, 20% +Tol, 20% -Tol, 0.0039uF, Through Hole Mount		F211AG392M400L	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211AG822J063P KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 5% +Tol, 5% -Tol, 0.0082uF, Through Hole Mount		F211AG822J063P	3D model not available Symbol and footprint not available 0	0 Build or Request
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