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Image Part Number D.S Description Package Category Prices / Stock Model Action
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R5F211A4DSP#U0 Renesas Electronics
1 The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp Small Outline Packages R5F211A4DSP#U0 1 Download Model
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R5F211A2SP#U0 Renesas Electronics
1 The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp Small Outline Packages R5F211A2SP#U0 1 Download Model
Part Image Part Image 1 - RF Receiver ASK, OOK 380MHz ~ 450MHz -110dBm 10kbps PCB, Surface Mount 16-QSOP Small Outline Packages MICRF211AYQS-TR 1 Download Model
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R5F211A1SP#U0 Renesas Electronics
1 The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp Small Outline Packages R5F211A1SP#U0 1 Download Model
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R5F211A3DSP Renesas Electronics
1 D Small Outline Packages R5F211A3DSP 1 Download Model
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R5F211A4SP#U0 Renesas Electronics
1 The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp Small Outline Packages R5F211A4SP#U0 1 Download Model
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F211AP824R063XLTF1 KEMET Corporation
1 Film Capacitor, Polyphenylene Sulphide, 63V, 2.5% +Tol, 2.5% -Tol, 0.82uF, Through Hole Mount F211AP824R063XLTF1 0 Build or Request
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F211AG682H250XLAF1 KEMET Corporation
1 Film Capacitor, Polyphenylene Sulphide, 250V, 2.5% +Tol, 2.5% -Tol, 0.0068uF, 5116 F211AG682H250XLAF1 0 Build or Request
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F211AG153J050C KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 50V, 5% +Tol, 5% -Tol, 0.015uF, Through Hole Mount F211AG153J050C 0 Build or Request
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F211AG563J250P KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 250V, 5% +Tol, 5% -Tol, 0.056uF, Through Hole Mount F211AG563J250P 0 Build or Request
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F211AP564K100XLTF1 KEMET Corporation
1 Film Capacitor, Polyphenylene Sulphide, 100V, 10% +Tol, 10% -Tol, 0.56uF, Through Hole Mount, 5124 F211AP564K100XLTF1 0 Build or Request
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F211AG682J250XLTF1 KEMET Corporation
1 Film Capacitor, Polyphenylene Sulphide, 250V, 5% +Tol, 5% -Tol, 0.0068uF, Through Hole Mount, 5116 F211AG682J250XLTF1 0 Build or Request
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F211AG104J050C KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 50V, 5% +Tol, 5% -Tol, 0.1uF, Through Hole Mount F211AG104J050C 0 Build or Request
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F211AG184R050P KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 50V, 2.5% +Tol, 2.5% -Tol, 0.18uF, Through Hole Mount F211AG184R050P 0 Build or Request
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F211AH824K050C KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 50V, 10% +Tol, 10% -Tol, 0.82uF, Through Hole Mount F211AH824K050C 0 Build or Request
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F211AG683J050P KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 50V, 5% +Tol, 5% -Tol, 0.068uF, Through Hole Mount F211AG683J050P 0 Build or Request
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F211AG153R250C KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 250V, 2.5% +Tol, 2.5% -Tol, 0.015uF, Through Hole Mount F211AG153R250C 0 Build or Request
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F211AG472M063XLAF1 KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 63V, 20% +Tol, 20% -Tol, 0.0047uF, Through Hole Mount F211AG472M063XLAF1 0 Build or Request
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F211AG392M050C KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 50V, 20% +Tol, 20% -Tol, 0.0039uF, Through Hole Mount F211AG392M050C 0 Build or Request
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F211AP564M100XLAF1 KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 100V, 20% +Tol, 20% -Tol, 0.56uF, Through Hole Mount F211AP564M100XLAF1 0 Build or Request
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F211AG472R400XLTF1 KEMET Corporation
1 Film Capacitor, Polyphenylene Sulphide, 400V, 2.5% +Tol, 2.5% -Tol, 0.0047uF, Through Hole Mount F211AG472R400XLTF1 0 Build or Request
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F211AG153K250C KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 250V, 10% +Tol, 10% -Tol, 0.015uF, Through Hole Mount F211AG153K250C 0 Build or Request
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F211AG392H400XLAF1 KEMET Corporation
1 Film Capacitor, Polyphenylene Sulphide, 400V, 2.5% +Tol, 2.5% -Tol, 0.0039uF, 5116 F211AG392H400XLAF1 0 Build or Request
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F211AG392R050ALG5C KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 50V, 2.5% +Tol, 2.5% -Tol, 0.0039uF, Through Hole Mount F211AG392R050ALG5C 0 Build or Request
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F211AG223K063ALG5C KEMET Corporation
1 Film Capacitor, Polyphenylene Sulfide, 63V, 10% +Tol, 10% -Tol, 0.022uF, Through Hole Mount F211AG223K063ALG5C 0 Build or Request
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