MSD02 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	EMIF06-MSD02N16 STMicroelectronics	1	6-Line EMI filter&ESD for SD card uQFN16 STMicroelectronics EMIF06-MSD02N16, EMI Filter & ESD Protector	Other	EMIF06-MSD02N16	3D model available Symbol and footprint available 3	1 Download Model
	MSD025TGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Wire Wrap		MSD025TGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD021TGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Solder		MSD021TGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02A05 Molex	1	Modular Terminal Block, 6A, 1 Row(s), 1 Deck(s)		MSD02A05	3D model not available Symbol and footprint not available 0	0 Build or Request

	MSD02120G1 Maplesemi	1	1200V silicon carbide diode with 9.5A continuous forward current, fast switching, high-frequency operation, and positive temperature coefficient on VF, suitable for power factor correction and motor drives.		MSD02120G1	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02B04 Molex	1	Modular Terminal Block, 6A, 1 Row(s), 1 Deck(s)		MSD02B04	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02O05 Molex	1	Modular Terminal Block, 6A, 1 Row(s), 1 Deck(s)		MSD02O05	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02STG8RAU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Solder		MSD02STG8RAU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD023GGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Wire Wrap		MSD023GGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02065G1 Maplesemi	1	650V Silicon Carbide Schottky Diode with 2.1A continuous forward current, 14A surge current, fast switching, positive temperature coefficient, and low thermal resistance of 3.22 C/W for high-efficiency power applications.		MSD02065G1	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD024GGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Wire Wrap		MSD024GGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02A04 Molex	1	Modular Terminal Block, 6A, 1 Row(s), 1 Deck(s)		MSD02A04	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02STGB8U MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder		MSD02STGB8U	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02SGGBU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder		MSD02SGGBU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02O04 Molex	1	Modular Terminal Block, 6A, 1 Row(s), 1 Deck(s)		MSD02O04	3D model not available Symbol and footprint not available 0	0 Build or Request

	MSD023TGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Wire Wrap		MSD023TGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02STGBU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder		MSD02STGBU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD022GGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Wire Wrap		MSD022GGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD022TGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Wire Wrap		MSD022TGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD024TGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Wire Wrap		MSD024TGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02B05 Molex	1	Modular Terminal Block, 6A, 1 Row(s), 1 Deck(s)		MSD02B05	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02STGRAU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Solder		MSD02STGRAU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD021GGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Solder		MSD021GGU	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSD02004 Sauro	1	Number of poles: 2, Clamp tightening, 12A, 1mm², 16AWG, 150V, Pitch 2,54 mm, Not stackable, Connection Angle 0°, Number of levels: 1, Green (RAL 6032), Housing composition: monolithic, Soldering technology Wave, UL, VDE, IMQ, CSA, CUL		MSD02004	3D model available Symbol and footprint not available 1	1 Download Model
	MSD025GGU MPE-Garry GmbH	1	IC Socket, DIP2, 2 Contact(s), 2.54mm Row Spacing, Wire Wrap		MSD025GGU	3D model not available Symbol and footprint not available 0	0 Build or Request
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