NV256 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	NV25640DWHFT3G onsemi	1	Automotive Temperatures Grade0: -40°C to +150°C/VCC = 2.5V to 5.5V; SOIC and TSSOP 8−pad Packages; 20/ 10 MHz SPI Compatible; SPI Modes (0,0) & (1,1); 32-byte Page Write Buffer; Self-timed Write Cycle; Hardware and Software Protection; Block Write Protection - Protect ¼, ½ or Entire EEPROM Array; Low Power CMOS Technology; 200 Year Data Retention; Additional Identification Page with Permanent Write Protection; NV Prefix for Automotive and Other Applications Requiring Site and Change Control; Program/Erase C	Small Outline Packages	NV25640DWHFT3G	3D model available Symbol and footprint available 3	1 Download Model
	NV25640DTHFT3G onsemi	1	Automotive Temperatures Grade0: -40°C to +150°C/VCC = 2.5V to 5.5V; SOIC and TSSOP 8−pad Packages; 20/ 10 MHz SPI Compatible; SPI Modes (0,0) & (1,1); 32-byte Page Write Buffer; Self-timed Write Cycle; Hardware and Software Protection; Block Write Protection - Protect ¼, ½ or Entire EEPROM Array; Low Power CMOS Technology; 200 Year Data Retention; Additional Identification Page with Permanent Write Protection; NV Prefix for Automotive and Other Applications Requiring Site and Change Control; Program/Erase C		NV25640DTHFT3G	3D model available Symbol and footprint not available 1	1 Download Model
	NV25640DTVLT3G onsemi	1	EEPROM, 8KX8, Serial, CMOS, PDSO8		NV25640DTVLT3G	3D model not available Symbol and footprint not available 0	0 Build or Request
	NV25640UVLT2G onsemi	1	EEPROM, 8KX8, Serial, CMOS, PDSO8		NV25640UVLT2G	3D model not available Symbol and footprint not available 0	0 Build or Request

	NV25640MUW3VTBG onsemi	1	EEPROM, 8KX8, Serial, CMOS		NV25640MUW3VTBG	3D model not available Symbol and footprint not available 0	0 Build or Request
	NV25640DTVFT3G onsemi	1	EEPROM, 8KX8, Serial, CMOS, PDSO8		NV25640DTVFT3G	3D model not available Symbol and footprint not available 0	0 Build or Request
	NV25640DWVLT3G onsemi	1	Automotive Temperatures Grade1: -40°C to +125°C/VCC = 1.7V to 5.5V; SOIC-8, US-8, TSSOP 8-Lead and Wettable Flank UDFN 8−pad Packages; 20/ 10 MHz SPI Compatible; SPI Modes (0,0) & (1,1); 32-byte Page Write Buffer; Self-timed Write Cycle; Hardware and Software Protection; Block Write Protection - Protect ¼, ½ or Entire EEPROM Array; Low Power CMOS Technology; 200 Year Data Retention; Additional Identification Page with Permanent Write Protection; NV Prefix for Automotive and Other Applications Requiring Site		NV25640DWVLT3G	3D model available Symbol and footprint not available 1	1 Download Model
	NV25640DWVFT3G onsemi	1	EEPROM, 8KX8, Serial, CMOS, PDSO8		NV25640DWVFT3G	3D model not available Symbol and footprint not available 0	0 Build or Request
	NV25640MUW3VLTBG onsemi	1	EEPROM		NV25640MUW3VLTBG	3D model not available Symbol and footprint not available 0	0 Build or Request
	FK901MNV2565FK050 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		FK901MNV2565FK050	3D model not available Symbol and footprint not available 0	0 Build or Request
	FK901MNV2565FKN70 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		FK901MNV2565FKN70	3D model not available Symbol and footprint not available 0	0 Build or Request
	8801MNV2560FKN3550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,800UF,330VDC,10% -TOL,20% +TOL		8801MNV2560FKN3550	3D model not available Symbol and footprint not available 0	0 Build or Request
	2901MNV2565FKN0550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		2901MNV2565FKN0550	3D model not available Symbol and footprint not available 0	0 Build or Request
	FK901MNV2565FKN50 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		FK901MNV2565FKN50	3D model not available Symbol and footprint not available 0	0 Build or Request
	FK801MNV2560FK010 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,800UF,330VDC,10% -TOL,20% +TOL		FK801MNV2560FK010	3D model not available Symbol and footprint not available 0	0 Build or Request

	FK901MNV2565FK000 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		FK901MNV2565FK000	3D model not available Symbol and footprint not available 0	0 Build or Request
	2801MNV2560FKN5550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,800UF,330VDC,10% -TOL,20% +TOL		2801MNV2560FKN5550	3D model not available Symbol and footprint not available 0	0 Build or Request
	1801MNV2560FKN5550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,800UF,330VDC,10% -TOL,20% +TOL		1801MNV2560FKN5550	3D model not available Symbol and footprint not available 0	0 Build or Request
	FK901MNV2565FKN40 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		FK901MNV2565FKN40	3D model not available Symbol and footprint not available 0	0 Build or Request
	1901MNV2565FKN4550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		1901MNV2565FKN4550	3D model not available Symbol and footprint not available 0	0 Build or Request
	1901MNV2565FKN7550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		1901MNV2565FKN7550	3D model not available Symbol and footprint not available 0	0 Build or Request
	2801MNV2560FKN2550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,800UF,330VDC,10% -TOL,20% +TOL		2801MNV2560FKN2550	3D model not available Symbol and footprint not available 0	0 Build or Request
	1801MNV2560FKN4550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,800UF,330VDC,10% -TOL,20% +TOL		1801MNV2560FKN4550	3D model not available Symbol and footprint not available 0	0 Build or Request
	2901MNV2565FKN3550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,900UF,330VDC,10% -TOL,20% +TOL		2901MNV2565FKN3550	3D model not available Symbol and footprint not available 0	0 Build or Request
	1801MNV2560FKN3550 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,800UF,330VDC,10% -TOL,20% +TOL		1801MNV2560FKN3550	3D model not available Symbol and footprint not available 0	0 Build or Request
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