PC755 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	NFM15PC755D0E3D Murata Electronics	1	Feed Through Capacitors	Other	NFM15PC755D0E3D	3D model available Symbol and footprint available 3	1 Download Model
	NFM15PC755R0G3D Murata Electronics	1	7.5 µF Feed Through Capacitor 4V 2 A 40mOhm 0402 (1005 Metric), 3 PC Pad	Other	NFM15PC755R0G3D	3D model available Symbol and footprint available 3	1 Download Model
	NFM15PC755R0E3D Murata Electronics	1	Capacitor L=1.0mm W=0.5mm T=0.5mm	Other	NFM15PC755R0E3D	3D model not available Symbol and footprint available 2	1 Download Model
	PC755VZF350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360		PC755VZF350LE	3D model not available Symbol and footprint not available 0	0 Build or Request

	PC755BVG366LE Teledyne e2v	1	RISC Microprocessor, 366MHz, CMOS, CBGA360, BGA-360		PC755BVG366LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755MZF350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360		PC755MZF350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755BMZFU300LD Atmel Corporation	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360		PC755BMZFU300LD	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755MZF400LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360		PC755MZF400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755CCSH400LE Teledyne e2v	1	RISC Microprocessor, 400MHz, CMOS, CBGA360, BGA-360		PC755CCSH400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755VG366LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360		PC755VG366LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755BCG300LE Teledyne e2v	1	RISC Microprocessor, 300MHz, CMOS, CBGA360, BGA-360		PC755BCG300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755CCZT400LE Teledyne e2v	1	RISC Microprocessor, 400MHz, CMOS, PBGA360, BGA-360		PC755CCZT400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755BCGS350LE Teledyne e2v	1	RISC Microprocessor, 350MHz, CMOS, CBGA360, CGA-360		PC755BCGS350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755CVGSU300LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360		PC755CVGSU300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755CMZFU350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP-CHIP, PLASTIC, BGA-360		PC755CMZFU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request

	PC755CMPH400LE Teledyne e2v	1	RISC Microprocessor, 400MHz, CMOS, CBGA360, BGA-360		PC755CMPH400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755CVZF400LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, FCBGA-360		PC755CVZF400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755CVZFU400LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360		PC755CVZFU400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755MGHU300LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360		PC755MGHU300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755CVGSU366LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360		PC755CVGSU366LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755VZFU366LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360		PC755VZFU366LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755BMGU350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360		PC755BMGU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755BVZFU300LD Thales Group	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360		PC755BVZFU300LD	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755BVGSU350LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360		PC755BVGSU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PC755BMSH300LE Teledyne e2v	1	RISC Microprocessor, 300MHz, CMOS, CBGA360, BGA-360		PC755BMSH300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
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