PCX75 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	PCX755M8VG350LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, CERAMIC, BGA-255	PCX755M8VG350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BMZFU400LE Thales Group	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360	PCX755BMZFU400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755CMZFU400LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360	PCX755CMZFU400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BMGH300LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360	PCX755BMGH300LE	3D model not available Symbol and footprint not available 0	0 Build or Request

	PCX755CVG400LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360	PCX755CVG400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BMGU350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360	PCX755BMGU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BMZFU366LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360	PCX755BMZFU366LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX750PMGSU300LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CICGA-360	PCX750PMGSU300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BVG300LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360	PCX755BVG300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755VGU300LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360	PCX755VGU300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BVGSU350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360	PCX755BVGSU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755VZF350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360	PCX755VZF350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755MZFU350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360	PCX755MZFU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755VGS300LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360	PCX755VGS300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755CMZFU400LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360	PCX755CMZFU400LE	3D model not available Symbol and footprint not available 0	0 Build or Request

	PCX755BMGU300LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360	PCX755BMGU300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BVGH300LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360	PCX755BVGH300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755MG300LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360	PCX755MG300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755VGU350LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360	PCX755VGU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BVZFU350LE Thales Group	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360	PCX755BVZFU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755VZFU400LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360	PCX755VZFU400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BMZFU350LD Atmel Corporation	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360	PCX755BMZFU350LD	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755MGS400LE Teledyne e2v	1	RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360	PCX755MGS400LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755M8VG300LE Atmel Corporation	1	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 25 MM, CERAMIC, BGA-255	PCX755M8VG300LE	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCX755BMZFU350LE Thales Group	1	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360	PCX755BMZFU350LE	3D model not available Symbol and footprint not available 0	0 Build or Request
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