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SBCP56-16T1G
onsemi
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1 | Collector current, IC = of 1.0 Amp; The SOT-223 package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant | SOT223 (3-Pin) | SBCP56-16T1G |
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![Part Image](["https://www.onsemi.com/PowerSolutions/product.do?id=SBCP56-16T1G","https://www.onsemi.com/PowerSolutions/product.do?id=SBCP56-16T1G","//content.supplyframe.com/images/process/fit-in/100x100/p/to261_4.jpg"])
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