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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	SNFPX033308JD4KSSD WIMA	1	Film Capacitors Snubber FKP 0.33 F 4000 VDC 33x48x56 PCM48.5	Other	SNFPX033308JD4KSSD	3D model available Symbol and footprint available 3	1 Download Model
	R5F21272SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21272SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212K2SNFP#X6 Renesas Electronics	1	The R8C/2K Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the suppo	Quad Flat Packages	R5F212K2SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21264SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21264SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model

	R5F21276SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21276SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21262SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21262SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212BCSNFP#X6 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212BCSNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21266SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21266SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21257SNFP#X6 Renesas Electronics	1	The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21257SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212L4SNFP#X6 Renesas Electronics	1	The R8C/2L Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2K Group and R8C/2L Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212L4SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21256SNFP#X6 Renesas Electronics	1	The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21256SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	SNFPX032208H1FKS00 Wima	1	Film Capacitor, Polypropylene, 4000V, 10% +Tol, 10% -Tol, 0.22uF,		SNFPX032208H1FKS00	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX031507H3QMS00 Wima	1	Film Capacitor, Polypropylene, 4000V, 20% +Tol, 20% -Tol, 0.15uF, Chassis Mount,		SNFPX031507H3QMS00	3D model not available Symbol and footprint not available 0	0 Build or Request

	SNFPX023307D1IJS00 Wima	1	Film Capacitor, Polypropylene, 4000V, 5% +Tol, 5% -Tol, 0.033uF,		SNFPX023307D1IJS00	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX023307D1KJSSD Wima	1	Film Capacitor,		SNFPX023307D1KJSSD	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX026807F2AKSSD Wima	1	Film Capacitor,		SNFPX026807F2AKSSD	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX02680SK5AMS00 Wima	1	Film Capacitor, Polypropylene, 4000V, 0.068uF		SNFPX02680SK5AMS00	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX02220SH3IMS00 Wima	1	Film Capacitor, Polypropylene, 4000V, 0.022uF		SNFPX02220SH3IMS00	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX03100SLD2KS00 Wima	1	Film Capacitor, Polypropylene, 4000V, 0.1uF		SNFPX03100SLD2KS00	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX02470SJ2IMS00 Wima	1	Film Capacitor, Polypropylene, 4000V, 0.047uF		SNFPX02470SJ2IMS00	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX022207C1JKSSD Wima	1	Film Capacitor,		SNFPX022207C1JKSSD	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX031007G2KKS00 Wima	1	Film Capacitor, Polypropylene, 4000V, 10% +Tol, 10% -Tol, 0.1uF,		SNFPX031007G2KKS00	3D model not available Symbol and footprint not available 0	0 Build or Request
	SNFPX032208H5AKSSD Wima	1	Film Capacitor,		SNFPX032208H5AKSSD	3D model not available Symbol and footprint not available 0	0 Build or Request
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