da14531 Footprint, Symbol and 3D Model search results

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Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
DA14531-01000OG2 Renesas Electronics	1	IC RF TxRx + MCU Bluetooth Bluetooth v5.1 2.4GHz 17-XFBGA, WLCSPn	Other	DA14531-01000OG2	3D model available Symbol and footprint available 3	1 Download Model
DA14531-00000OG2 Renesas Electronics	1	SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal	BGA	DA14531-00000OG2	3D model available Symbol and footprint available 3	1 Download Model
DA14531MOD-00F0100C Renesas Electronics	1	Bluetooth Modules (802.15.1) Bluetooth Low Energy 5.1 Module with integrated ARM Cortex M0+, memories and peripherals ? 8 GPIOs	Other	DA14531MOD-00F0100C	3D model available Symbol and footprint available 3	1 Download Model
DA14531MOD-00F01002 Renesas Electronics	1	The DA14531 SmartBond TINY™ Module is the Bluetooth® Low Energy (LE) solution that will power the next 1 billion IoT devices through ease of use.The DA14531 SmartBond TINY™ Module, based on the world’s smallest and lowest power Bluetooth 5.1 system-on-chip (SoC), brings the DA14531 SoC advantages to an integrated module. It just requires a power supply and a printed circuit board to build a Bluetooth application. The module targets broad market use and is certified across regions providing significant savin	Other	DA14531MOD-00F01002	3D model available Symbol and footprint available 3	1 Download Model

da14531 Renesas Electronics	1			da14531	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531-00000OG2 Dialog Semiconductor GmbH	1	Telecom Circuit,		DA14531-00000OG2	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531-00000FX2 Dialog Semiconductor GmbH	1	Telecom Circuit,		DA14531-00000FX2	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531MOD-00F01002 Dialog Semiconductor GmbH	1	Telecom IC,		DA14531MOD-00F01002	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531-01000FX2 Renesas Electronics	1	SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal		DA14531-01000FX2	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531-00000FX2 Renesas Electronics	1	SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal		DA14531-00000FX2	3D model available Symbol and footprint not available 1	1 Download Model
DA14531MOD-00F0100 Dialog Semiconductor GmbH	1	Telecom IC,		DA14531MOD-00F0100	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531MOD-00F0100C Dialog Semiconductor GmbH	1	Telecom IC,		DA14531MOD-00F0100C	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531MOD-00F1DB-P Renesas Electronics	1	The DA14531MOD-00DEVKT-P Bluetooth Low Energy Development Kit Pro for the DA14531 SmartBond TINY™ module includes a motherboard, daughterboard and cables. This kit is primarily used for software application development and power measurements.The DA14531 daughterboard features an integrated semiconductor DA14531 SmartBond TINY™ module. The DA14531 SmartBond TINY™ module daughterboard has the capability of mounting a MikroBUS™ module. This DA14531 daughterboard comes in 58.43mm x 44.46mm dimensions.The purpos		DA14531MOD-00F1DB-P	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531-00FXDEVKT-U Renesas Electronics	1	The DA14531 SmartBond TINY™ USB Development Kit gives you all the flexibility to develop applications in a small and portable form factor.This kit offers a low-cost development board with basic functionality. The development kit is implemented on a single PCB. The purpose of this cost-effective USB kit is to provide users with the capability for:tSoftware developmenttProgramming DA14531 via JTAG or UART using the DA14531 SDKtConnecting MikroBUS™ modulesSmartBond TINY™, the world’s smallest and lowest power		DA14531-00FXDEVKT-U	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531-00FXDB-P Renesas Electronics	0	The DA14531 SmartBond TINY™ Development Kit Pro (DA14531-00FXDEVKT-P) is the most ideal way to quickly and easily get started developing applications and products using the DA14531 Bluetooth® Low Energy (LE) system-on-chip SoC.The DA14531-00FXDB-P is the FCGQFN24 daughterboard for the DA14531 Development Kit Pro's motherboard.		DA14531-00FXDB-P	3D model not available Symbol and footprint not available 0	0 Build or Request

DA14531-00FXDEVKT-P Renesas Electronics	1	The DA14531 SmartBond TINY™ Development Kit Pro is the most ideal way to quickly and easily get started developing applications and products using the DA14531 Bluetooth® Low Energy (LE) system-on-chip SoC.		DA14531-00FXDEVKT-P	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531-01FXDB-P Renesas Electronics	1	The DA14531-01FXDB-P is the FCGQFN24 daughterboard for the DA14531 Development Kit Pro's motherboard.The DA14531-01 SmartBond TINY™ Development Kit Pro (DA14531-00FXDEVKT-P) is the most ideal way to quickly and easily get started developing applications and products using the DA145301-01 Bluetooth® Low Energy (LE) system-on-chip SoC.		DA14531-01FXDB-P	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531-00OGDB-P Renesas Electronics	1	The DA14531 SmartBond TINY™ Development Kit Pro (DA14531-00FXDEVKT-P) is the most ideal way to quickly and easily get started developing applications and products using the DA14531 Bluetooth® Low Energy (LE) system-on-chip SoC.The DA14531-00OGDB-P is the WL-CSP daughterboard that can be ordered separately for the DA14531 SmartBond TINY™ Development Kit Pro's motherboard.		DA14531-00OGDB-P	3D model not available Symbol and footprint not available 0	0 Build or Request
DA14531MOD-00DEVKT-P Renesas Electronics	1	The DA14531MOD-00DEVKT-P Bluetooth Low Energy Development Kit Pro for the DA14531 SmartBond TINY™ module includes a motherboard, daughterboard and cables. This kit is primarily used for software application development and power measurements.The DA14531 is a family of Bluetooth Low Energy (LE) devices that operate at very low power levels while providing world-class RF performance. This device is available in a small footprint while still offering large flexibility in configuration of the on-chip interfaces		DA14531MOD-00DEVKT-P	3D model not available Symbol and footprint not available 0	0 Build or Request
US159-DA14531EVZ Renesas Electronics	1	The US159-DA14531EVZ Low Power Bluetooth Pmod™ module enables the user to add low power Bluetooth capability to any evaluation kit or microcontroller board equipped with a Pmod expansion capability. The board provides a standard Pmod™ Type 3A (Expanded UART) connection for the on-board Bluetooth 5.1 module.The US159-DA14531EVZ features a Type 3A Pmod™ connector and incorporates the DA14531 SmartBond TINY™ Module, based on the world’s smallest and lowest power Bluetooth 5.1 System-on-Chip. Thanks to the stan		US159-DA14531EVZ	3D model not available Symbol and footprint not available 0	0 Build or Request

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