Showing 25 of 36 results
Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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EMMC32G-TX29-8AD11
Kingston Technology
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1 | eMMC 32GB eMMC 5.1 (HS400) 153B | BGA | EMMC32G-TX29-8AD11 |
3
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EMMC16G-W525
Kingston Technology
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1 | Embedded Multi-Media Card, BGA-153 | BGA | EMMC16G-W525 |
3
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Download Model | |
EMMC04G-MK27-C01C
Kingston Technology
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1 | eMMC 4GB eMMC 5.0 (HS400) 153B | BGA | EMMC04G-MK27-C01C |
3
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EMMC08G-MV28-01J10
Kingston Technology
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1 | eMMC eMMC 5.1 (HS400) 153B 8GB | BGA | EMMC08G-MV28-01J10 |
3
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EMMC128-IY29-5B111
Kingston Technology
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1 | eMMC eMMC 128GB I-temp eMMC 5.1 (HS400) 153B (Boosted Performance) | BGA | EMMC128-IY29-5B111 |
3
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D1216ECMDXGJDI-U
Kingston Technology
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1 | DRAM Chip DDR3 SDRAM 2Gbit 128M x 16 1.35V 96-Pin FBGA - Bag | BGA | D1216ECMDXGJDI-U |
3
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04EM08-M4EM627-GA06
Kingston Technology
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1 | Multichip Packages 4GB+8Gb149 ball FBGA | BGA | 04EM08-M4EM627-GA06 |
3
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EMMC04G-W627-06D00
Kingston Technology
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1 | eMMC- 40 C + 85 C FBGA 153 | BGA | EMMC04G-W627-06D00 |
3
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D2516ACXGXGRK-U
Kingston Technology
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1 | 4Gb, 96 ball FBGA DDR4 C-Temp, 7.5x13x1.2, 1.2V, 0°C ~ +95°C. DDR4 FBGA | BGA | D2516ACXGXGRK-U |
3
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EMMC08G-WV28-01J22
Kingston Technology
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1 | eMMC pSLC eMMC 5.1 (HS400) 153B itemp 8GB | BGA | EMMC08G-WV28-01J22 |
2
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EMMC32G-TX29-8AC01
Kingston Technology
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1 | 32GB eMMC v5.1 153-ball FBGA Operating Temperature - 25C to +85C | BGA | EMMC32G-TX29-8AC01 |
3
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D2516EC4BXGGB
Kingston Technology
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1 | DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V | BGA | D2516EC4BXGGB |
3
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D1621PM4CDGUI-U
Kingston Technology
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1 | SDRAM - Mobile LPDDR4 Memory IC 16Gbit Parallel 1.866 GHz 3.5 ns 200-FBGA (10x14.5) | BGA | D1621PM4CDGUI-U |
3
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EMMC04G-MT32-01G00
Kingston Technology
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1 | eMMC eMMC 5.0 (HS400) 153B 4GB | BGA | EMMC04G-MT32-01G00 |
3
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D0811PM2FDGUKW-U
Kingston Technology
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1 | DRAM itemp 8Gb 200 ball LPDDR4 3733MHz | BGA | D0811PM2FDGUKW-U |
3
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D1611PM3BDGUI-U
Kingston Technology
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1 | • Die Density: 16Gbits\r\n• Organization\r\n– x 16 bits: 128M words x 16 bits x 8 banks\r\n– 2 pieces of 16Gb (x16) in one package\r\n(For 32Gb case)\r\n– Row Address: R0 ~ R16\r\n– Column Address: C0 ~ C9\r\n• Package\r\n– 200-ball FBGA\r\n• Power supply\r\n– VDD1 = 1.8V (1.70V to 1.95V) ,\r\n– VDD2, VDDCA and VDDQ = 1.1V (1.06V to\r\n1.17V)\r\n• Data rate:\r\n– 3733Mbps max. Backward compatible\r\n• Eight internal banks per channel for concurrent\r\noperation\r\n• Burst lengths (BL): 16, 32 and on-the-fly\r\n- On the fly mode is enabled by | BGA | D1611PM3BDGUI-U |
3
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EMMC32G-TX29-8AD01
Kingston Technology
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1 | Kingston eMMC 5.1 (HS400) 153B 32GB (Sustained Performance) | BGA | EMMC32G-TX29-8AD01 |
3
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Download Model | |
D2516ECMDXGJD-U
Kingston Technology
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1 | DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin FBGA | BGA | D2516ECMDXGJD-U |
3
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EMMC16G-TB29-70H01
Kingston Technology
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1 | eMMC 16GB eMMC 5.1 (HS400) 153B 16GB | BGA | EMMC16G-TB29-70H01 |
3
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Download Model | |
EMMC256-IY29-5B111
Kingston Technology
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1 | eMMC eMMC 256GB I-temp eMMC 5.1 (HS400) 153B (Boosted Performance) | BGA | EMMC256-IY29-5B111 |
3
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Download Model | |
D1621XM4CDGVI-U
Kingston Technology
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1 | DRAM 16Gb 200 ball LPDDR4x 4266MHz SDP | BGA | D1621XM4CDGVI-U |
3
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B3221XM3BDGVI-U
Kingston Technology
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1 | DRAM 32Gb 1024Mx32 200 ball LPDDR4x 4266MHz | BGA | B3221XM3BDGVI-U |
3
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EMMC32G-KC30-01B01
Kingston Technology
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1 | eMMC 32GB eMMC 5.1 (HS400) 153B (Small Package 8.0x8.5x0.9) | BGA | EMMC32G-KC30-01B01 |
3
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EMMC16G-MW28-01E10
Kingston Technology
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1 | eMMC commercial temp eMMC 5.1 (HS400) 153B 16GB | BGA | EMMC16G-MW28-01E10 |
3
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Download Model | |
EMMC04G-WT32-01G02
Kingston Technology
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1 | FLASH - NAND Memory IC 4Gbit eMMC 153-FBGA (11.5x13) | BGA | EMMC04G-WT32-01G02 |
3
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Download Model | |