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D2516EC4BXGGB - Kingston Technology

Description: DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V

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PCB Footprints
D2516EC4BXGGB - Kingston Technology PCB footprint - BGA - BGA - 96-ball FBGA_1
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3D Models
D2516EC4BXGGB - Kingston Technology  - 3D model - BGA - 96-ball FBGA_1
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D2516EC4BXGGB Details

  • Manufacturer Part Number:

    D2516EC4BXGGB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Kingston Technology Company

  • YTEOL:

    0

  • Additional Feature:

    SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B96

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR3L DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    256MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Self Refresh:

    YES

  • Supply Voltage-Nom (Vsup):

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

D2516EC4BXGGB Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the D2516EC4BXGGB is 0°C to 85°C (32°F to 185°F).
  • Kingston recommends using a heat sink or thermal interface material to maintain a temperature below 85°C (185°F) during operation.
  • The maximum power consumption of the D2516EC4BXGGB is 3.3W (1.2V) or 3.6W (1.35V) depending on the operating frequency.
  • The D2516EC4BXGGB is designed to operate at 1.2V or 1.35V, but it's not recommended to use it with a different voltage supply without consulting Kingston's technical support team.
  • Kingston recommends implementing error correction mechanisms, such as ECC or CRC, to detect and correct errors. Additionally, the module's datasheet provides information on error handling and exception management.

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