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10AX027E4F29E3SG - Intel

Description: FPGA Arria® 10 GX Family 270000 Cells 20nm Technology 0.9V 780-Pin FC-FBGA

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PCB Footprints
10AX027E4F29E3SG - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX027E4F29E3SG - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AX027E4F29E3SG Details

  • Manufacturer Part Number:

    10AX027E4F29E3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    10162

  • Number of Inputs:

    360

  • Number of Logic Cells:

    270000

  • Number of Outputs:

    360

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Organization:

    10162 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10AX027E4F29E3SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX027E4F29E3SG is approximately 12W, but this can vary depending on the specific use case and design implementation.
  • Intel recommends using a clocking scheme that includes a dedicated clock tree, with a clock source that is decoupled from the FPGA's internal clock network. Additionally, using a clock domain crossing (CDC) technique can help ensure reliable clocking.
  • To optimize the 10AX027E4F29E3SG for high-speed interfaces, Intel recommends using the FPGA's built-in transceivers, such as the PCIe Gen3 and Gen4 IP cores, and implementing a robust signal integrity design. Additionally, using Intel's Quartus Prime software can help optimize the design for high-speed interfaces.
  • To ensure reliable data transmission, Intel recommends implementing error correction mechanisms, such as CRC and ECC, and using a robust data encoding scheme. Additionally, using Intel's built-in IP cores, such as the PCIe Gen3 and Gen4 IP cores, can help ensure reliable data transmission.
  • Intel recommends a design flow that includes RTL design, synthesis, placement, routing, and timing closure. Additionally, using Intel's Quartus Prime software can help streamline the design flow and ensure optimal results.

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10AX027E4F29E3SG Overview

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