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10M02SCU169I7G - Intel

Description: FPGA - Field Programmable Gate Array non-volatile FPGA, 130 I/O, 169UBGA

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10M02SCU169I7G - Intel PCB footprint - BGA - BGA - 10M02SCU169I7G-1
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10M02SCU169I7G - Intel  - 3D model - BGA - 10M02SCU169I7G-1
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10M02SCU169I7G Details

  • Manufacturer Part Number:

    10M02SCU169I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B169

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    125

  • Number of Inputs:

    246

  • Number of Logic Cells:

    2000

  • Number of Outputs:

    246

  • Number of Terminals:

    169

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA169,13X13,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

10M02SCU169I7G Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide and thermal management guidelines in their documentation, which should be followed to ensure optimal performance and reliability.
  • Intel provides power estimation and optimization tools, such as the Power Analyzer, to help optimize power consumption. Additionally, implementing power-saving features like clock gating and dynamic voltage and frequency scaling can also help reduce power consumption.
  • Intel recommends using their proprietary security features, such as the Secure Device Manager and the FPGA's built-in AES encryption, to protect the configuration and IP. Additionally, using secure boot mechanisms and encrypting the configuration data can also help prevent IP theft.
  • Intel provides environmental and operating condition specifications in the datasheet. To ensure reliable performance, it's essential to follow these specifications and implement robust design practices, such as using decoupling capacitors and ensuring adequate power supply filtering.
  • Intel provides a comprehensive design flow and toolset, including the Quartus Prime Design Software, to develop and verify IP cores for their FPGAs. Additionally, third-party tools and IP cores from partners and the open-source community can also be used.

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