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10M08SAE144C8G - Intel

Description: FPGA - Field Programmable Gate Array

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10M08SAE144C8G - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.0
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10M08SAE144C8G - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.0
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 10M08SAE144C8G
  • Part Number 10M08SAE144C8G
  • Manufacturer Intel
  • Pin Count 145
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.0
  • Released Date Dec 21, 2020
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

10M08SAE144C8G Details

  • Manufacturer Part Number:

    10M08SAE144C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    QFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    500

  • Number of Inputs:

    250

  • Number of Logic Cells:

    8000

  • Number of Outputs:

    250

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

10M08SAE144C8G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M08SAE144C8G is -40°C to 100°C.
  • To implement a CDC in the 10M08SAE144C8G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum frequency achievable with the 10M08SAE144C8G depends on the specific design and implementation, but Intel's Quartus II software can help estimate the maximum frequency based on the design's complexity and resource utilization.
  • To optimize power consumption in the 10M08SAE144C8G, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling, and leverage Intel's PowerPlay power analysis and optimization tools.
  • The 10M08SAE144C8G can be configured using JTAG, AS, or PS mode, and can also be configured using external memory devices such as flash or SRAM.

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