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1731070662 - Molex

Description: FCT Mixed Layout D-Sub Housing, Male, Tin-plated Shell with Dimples, 6.50mm Rear Through Hole Spacer, 8 Circuits Unloaded, Green Insulator

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1731070662 Details

  • Manufacturer Part Number:

    1731070662

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    8.5

  • Body Breadth:

    0.492 inch

  • Body Depth:

    0.291 inch

  • Body Length:

    2.728 inch

  • Body/Shell Style:

    PLUG

  • Connector Type:

    D SUBMINIATURE CONNECTOR

  • Contact Arrangement:

    S0C8

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    NOT APPLICABLE

  • Contact Gender:

    MALE

  • Contact Material:

    NOT SPECIFIED

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    10 mΩ

  • Contact Style:

    RND PIN-SKT

  • Empty Shell:

    YES

  • Filter Feature:

    NO

  • Insertion Force-Max:

    3.4 N

  • Insulation Resistance:

    5000000000 Ω

  • Insulator Material:

    POLYBUTYLENE TEREPHTHALATE

  • Mating Contact Pitch:

    0.25 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    HOLE .122

  • Mounting Option 2:

    LOCKING

  • Mounting Type:

    PANEL

  • Number Of Connectors:

    ONE

  • Number of Rows Loaded:

    1

  • Operating Temperature-Max:

    115 °C

  • Operating Temperature-Min:

    -55 °C

  • Option:

    GENERAL PURPOSE

  • PCB Contact Pattern:

    RECTANGULAR

  • Shell Finish:

    TIN

  • Shell Material:

    STEEL

  • Shell Size:

    4/C

  • Terminal Pitch:

    6.35 mm

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    8

  • Withdrawl Force-Min:

    0.2 N

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1731070662 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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