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2305B-1HDCGI - Renesas Electronics

Description: The 2305B is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2305B is an 8-pin version of the 2309B. The 2305B accepts one reference input, and drives out five low skew clocks. The -1H version of this device operates, up to 133MHz frequency and has a higher drive than the -1 device. All parts have on-

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2305B-1HDCGI - Renesas Electronics - PCB symbol
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2305B-1HDCGI - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 4.90x3.90x1.50 mm 1.27mm Pit
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2305B-1HDCGI - Renesas Electronics - 3D model - Small Outline Packages - SOIC 4.90x3.90x1.50 mm 1.27mm Pit
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2305B-1HDCGI Details

  • Manufacturer Part Number:

    2305B-1HDCGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    2305

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    32 mA

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    133 MHz

2305B-1HDCGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1.5 mm via diameter for efficient heat dissipation.
  • Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 125°C. Also, ensure a stable power supply and minimize power dissipation in the device.
  • Use a minimum of 10 uF ceramic capacitors with a voltage rating of 10 V or higher, placed as close as possible to the power pins. Add additional capacitors (e.g., 1 uF, 0.1 uF) for further noise reduction.
  • Use a high-quality clock source with a low jitter specification. Ensure the clock signal is properly terminated, and the PCB trace impedance is matched to the clock signal's characteristic impedance.
  • Set the internal voltage regulator to 1.2 V or 1.35 V, depending on the specific application requirements. Ensure the input voltage is within the recommended range (1.71 V to 3.6 V) and the output current does not exceed 100 mA.

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2305B-1HDCGI Overview

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