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2305NZ-1HDCGI - Renesas Electronics

Description: The IDT2305NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems. The IDT2305NZ operates at 3.3V with five outputs that can run up to 133.33MHz The IDT2305NZ is an 8-pin version of the IDT2309NZ. It is designed for low EMI and power optimization and consumes less than 32mA at 66.6MHz, making it ideal for the low power requirements of mobile systems.

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2305NZ-1HDCGI Details

  • Manufacturer Part Number:

    2305NZ-1HDCGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    2305

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • fmax-Min:

    133.33 MHz

2305NZ-1HDCGI Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power traces.
  • Renesas recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. Ensure the heat sink is properly attached and the system is designed to operate within the specified temperature range.
  • Renesas recommends using a low-ESR ceramic capacitor with a value of 4.7 μF to 10 μF, rated for the input voltage. X5R or X7R dielectrics are suitable for this application.
  • Renesas recommends using a shielded inductor, placing the device and input/output components close together, and using a common-mode choke to reduce EMI. Ensure proper grounding and decoupling of the device.
  • Renesas recommends keeping the input voltage deviation within ±10% of the nominal input voltage to ensure reliable operation and prevent damage to the device.

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2305NZ-1HDCGI Overview

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