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2305NZ-1HDCGI8 - Renesas Electronics

Description: The IDT2305NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems. The IDT2305NZ operates at 3.3V with five outputs that can run up to 133.33MHz The IDT2305NZ is an 8-pin version of the IDT2309NZ. It is designed for low EMI and power optimization and consumes less than 32mA at 66.6MHz, making it ideal for the low power requirements of mobile systems.

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2305NZ-1HDCGI8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - DC/DCG8
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2305NZ-1HDCGI8 Details

  • Manufacturer Part Number:

    2305NZ-1HDCGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    2305

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

2305NZ-1HDCGI8 Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power traces.
  • Renesas recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. Ensure the heat sink is properly attached and the system is designed to operate within the specified temperature range.
  • Renesas recommends using 100 nF to 1 μF decoupling capacitors with an ESR of less than 1 Ω, placed as close as possible to the device's power pins. Use a capacitor with a voltage rating of at least 1.5 times the maximum operating voltage.
  • Renesas recommends using a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating. Ensure the ESD protection circuit is placed close to the device's input pins and connected to a solid ground plane.
  • Renesas recommends using a PCB material with a high thermal conductivity (e.g., FR4 or equivalent) and a low coefficient of thermal expansion (CTE) to minimize thermal stress on the device.

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2305NZ-1HDCGI8 Overview

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