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553MLFT - Renesas Electronics

Description: The 553 is a low skew, single input to four output, clock buffer. Part of Renesas' ClockBlocks™ family, this is our lowest skew, small clock buffer. See the 552-02 for a 1 to 8 low skew buffer. For more than eight outputs, see the MK74CBxxx Buffalo™ series of clock drivers. Renesas makes many non-PLL and PLL based low skew output devices as well as Zero Delay Buffers to synchronize clocks. Contact us for all of your clocking needs.

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553MLFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-ren2
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553MLFT Details

  • Manufacturer Part Number:

    553MLFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    553

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.035 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    5 ns

  • Propagation Delay (tpd):

    5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    200 MHz

553MLFT Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 553MLFT is -40°C to 125°C.
  • To ensure reliable operation in high-temperature environments, it is recommended to use a heat sink and ensure good thermal conductivity between the device and the heat sink. Additionally, reducing the power consumption and using a thermal interface material can help to reduce the junction temperature.
  • The maximum allowable power dissipation for the 553MLFT is 1.5W. Exceeding this limit can cause the device to overheat and potentially fail.
  • To handle ESD protection for the 553MLFT, it is recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Additionally, following proper handling and storage procedures can help to prevent ESD damage.
  • The recommended layout and routing for the 553MLFT involves keeping the signal traces short and direct, using a solid ground plane, and avoiding vias and right-angle bends. Additionally, it is recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.

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553MLFT Overview

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Part Image 553MIT Integrated Device Technology Inc

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