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5962-0151201VPA - Texas Instruments

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5962-0151201VPA Details

  • Manufacturer Part Number:

    5962-0151201VPA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    1.5 A

  • Output Peak Current Limit-Nom:

    1 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-PRF-38535 Class V

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    20 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.08 µs

  • Turn-on Time:

    0.08 µs

  • Width:

    7.62 mm

5962-0151201VPA Frequently Asked Questions (FAQs)

  • A good PCB layout should prioritize thermal dissipation, with a solid ground plane and thermal vias. Ensure a minimum of 1 oz copper thickness and a 4-layer stack-up. For thermal management, use a heat sink with a thermal interface material and ensure good airflow.
  • Use a multi-layer PCB with a solid ground plane, and ensure proper decoupling and filtering. Implement a shielded enclosure, and consider using EMI-absorbing materials. Follow TI's recommended layout and routing guidelines for optimal EMC performance.
  • The 5962-0151201VPA is designed for high-reliability applications, with a typical lifespan of 10-15 years. However, this can vary depending on environmental factors, operating conditions, and quality of the PCB assembly. Follow TI's recommended storage and handling guidelines to ensure optimal reliability.
  • The 5962-0151201VPA is not specifically designed for radiation-hardened or space-grade applications. However, TI offers other products that are specifically designed for these environments. Consult with TI's aerospace and defense team for guidance on selecting the appropriate device for your application.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, increased power consumption, and decreased lifespan. Ensure proper thermal management and follow TI's recommended operating conditions to avoid premature device failure.

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5962-0151201VPA Overview

Use the download button to access the 5962-0151201VPA 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 5962-, or try a keyword search, such as MOSFET Drivers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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