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5962-3829406MXA - Renesas Electronics

Description: The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation.

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5962-3829406MXA - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - CD28--
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5962-3829406MXA Details

  • Manufacturer Part Number:

    5962-3829406MXA

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    CERAMIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    CD28

  • Country Of Origin:

    USA

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    70 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-GDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    60.96 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    8KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    4.826 mm

  • Standby Current-Max:

    0.0003 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.09 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

5962-3829406MXA Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a dedicated ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane.
  • Implement a robust communication protocol with error detection and correction mechanisms. Ensure signal integrity by using differential signaling, and consider using a common-mode choke to reduce EMI.
  • Power sequencing should follow the recommended power-up sequence in the datasheet. Ensure a slow and controlled voltage ramp-up (typically 1-2ms) to prevent damage to the device.
  • Handle the device in an ESD-protected environment, using wrist straps, anti-static bags, and ESD-safe workbenches. Store the device in its original packaging or an anti-static bag in a dry, cool place.
  • Perform functional testing, including signal integrity and power consumption tests. Validate the device's performance using a combination of simulation tools, bench testing, and environmental stress testing.

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5962-3829406MXA Overview

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