5962-8688201XA footprint, schematic symbol and 3D model by Analog Devices

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PCB Footprints

5962-8688201XA - Analog Devices PCB footprint - Other - Other - H Package 3-Lead TO-39 Metal Can_2025-1.1

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Datasheet Download Datasheet
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Part Number 5962-8688201XA
Manufacturer Analog Devices
Pin Count 3
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - H Package 3-Lead TO-39 Metal Can_2025-1.1
Released Date Nov 16, 2025
Last Modified Date Dec 4, 2025 10:21 AM UTC
Pinout / Pin List Click Here (Member Only)

5962-8688201XA Details

Manufacturer Part Number:
5962-8688201XA
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Part Life Cycle Code:
Not Recommended
Part Package Code:
BCY
Package Description:
CAN, 3 PIN
Pin Count:
3
Manufacturer Package Code:
05-08-1330
Country Of Origin:
Philippines
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
3
Analog IC - Other Type:
THREE TERMINAL VOLTAGE REFERENCE
JESD-30 Code:
O-MBCY-W3
JESD-609 Code:
e0
Length:
9.02 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
3
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
0.005 A
Output Voltage-Max:
10.03 V
Output Voltage-Min:
9.97 V
Output Voltage-Nom:
10 V
Package Body Material:
METAL
Package Code:
BCY
Package Equivalence Code:
CAN3/4,.2
Package Shape:
ROUND
Package Style:
CYLINDRICAL
Peak Reflow Temperature (Cel):
245
Qualification Status:
Qualified
Screening Level:
MIL-STD-883
Seated Height-Max:
4.7 mm
Supply Current-Max (Isup):
1 mA
Supply Voltage-Max (Vsup):
33 V
Supply Voltage-Min (Vsup):
13 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
NO
Technology:
BIPOLAR
Temp Coef of Voltage-Max:
16 ppm/°C
Temperature Grade:
MILITARY
Terminal Finish:
Tin/Lead (Sn/Pb)
Terminal Form:
WIRE
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
20
Trim/Adjustable Output:
NO
Voltage Tolerance-Max:
0.1%

5962-8688201XA Frequently Asked Questions (FAQs)

A good PCB layout for the 5962-8688201XA involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI. Additionally, placing decoupling capacitors close to the device's power pins can help filter out noise.
To ensure the 5962-8688201XA operates within its specified temperature range, provide adequate heat sinking, use a thermally conductive material for the PCB, and avoid exposing the device to extreme temperatures during storage or operation. Additionally, consider using thermal interface materials or heat sinks to improve heat dissipation.
Exceeding the maximum power dissipation of the 5962-8688201XA can lead to reduced reliability, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within its specified power dissipation limits to maintain its performance and longevity.
To troubleshoot issues with the 5962-8688201XA, start by verifying the device's pin connections, power supply voltages, and input signals. Use an oscilloscope to monitor the output voltages and currents, and check for any signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
Yes, the 5962-8688201XA is a high-frequency device, and as such, it requires careful attention to EMI/EMC considerations. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference and ensure compliance with relevant EMC standards.

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5962-8688201XA Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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