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5962-8866202XA - Renesas Electronics

Description: The 5962-88662 (71256 SRAM) is organized as 32K x 8. This part offers a reduced power standby mode for significant system level power and cooling savings. Fully static asynchronous circuitry is used; no clocks or refreshes are required for operation.

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5962-8866202XA - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - CD28-
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5962-8866202XA Details

  • Manufacturer Part Number:

    5962-8866202XA

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    0.600 INCH, CERDIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    CD28

  • Country Of Origin:

    USA

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    70 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-GDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    37.211 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    28

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    32KX8

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    38535Q/M;38534H;883B

  • Seated Height-Max:

    5.08 mm

  • Standby Current-Max:

    0.02 A

  • Standby Voltage-Min:

    4.5 V

  • Supply Current-Max:

    0.105 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

5962-8866202XA Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) for thermal management. It suggests using a 4-layer PCB with a solid ground plane, placing thermal vias under the package, and using a thermal pad on the bottom of the package.
  • Renesas recommends following their thermal design guidelines, using a heat sink or thermal interface material, and ensuring good airflow around the device. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal throttling or shutdown if necessary.
  • Renesas recommends following their power sequencing guidelines, which typically involve ramping up the power supplies in a specific order (e.g., VCC, then VDD, then AVCC). The voltage ramp-up rate should be controlled to avoid overshoots and ensure a stable power-on reset.
  • Renesas provides guidelines for EMI and EMC in their application notes. Key recommendations include using a shielded enclosure, minimizing trace lengths and loop areas, using decoupling capacitors, and implementing EMI filters or common-mode chokes as needed.
  • Renesas recommends following their clock signal integrity guidelines, which include using a low-jitter clock source, minimizing clock signal trace lengths, and using clock signal conditioning circuits or buffers as needed. The device's clock input tolerance is typically specified in the datasheet.

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5962-8866202XA Overview

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