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5CSEBA5U23C8N - Intel

Description: FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

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5CSEBA5U23C8N - Intel PCB footprint - BGA - BGA - 672-Pin Ultra FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSEBA5U23C8N - Intel  - 3D model - BGA - 672-Pin Ultra FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSEBA5U23C8N Details

  • Manufacturer Part Number:

    5CSEBA5U23C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 MM, ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3207 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEBA5U23C8N Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a mix of power and ground planes is recommended. Use a grid-based layout for signal traces and keep high-speed signals away from power planes.
  • Use the Intel Power Analyzer tool to estimate power consumption. Optimize by reducing clock frequencies, using low-power modes, and minimizing toggle rates.
  • Use a heat sink or thermal interface material to dissipate heat. Ensure good airflow and avoid blocking airflow around the FPGA. Monitor temperature using the on-chip thermal sensor.
  • Use controlled impedance traces, add termination resistors, and use differential signaling. Simulate signal integrity using tools like IBIS or S-Parameter models.
  • Use the FPGA's built-in security features like AES encryption and secure boot mechanisms. Implement secure key storage and authentication mechanisms.

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5CSEBA5U23C8N Overview

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